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Article

Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones

1
Łukasiewicz Research Network-Institute of Non-Ferrous Metals, Sowińskiego 5, 44-121 Gliwice, Poland
2
Aurubis AG, Kupferstrasse 23, D-44532 Lünen, Germany
*
Author to whom correspondence should be addressed.
Received: 20 August 2020 / Revised: 4 September 2020 / Accepted: 7 September 2020 / Published: 9 September 2020
The electronic components mounted on the printed circuit boards (PCBs) of mobile phones represent a resource that is rich in metals, and after separation from the boards, these components could be considered secondary raw materials. The concentrations of the valuable metals are insignificant when compared with those of complete PCBs; however, they could be significantly higher in a fraction formed from the separated components. This study focused on the analysis of Ag, Au, Cu, Nd, Nb, Ni, Pb, Pd, Sn, and Ta in fractions produced by the separation of all the components mounted on PCBs from several types of mobile phones. Atomic absorption spectrometry, atomic emission spectrometry, and mass spectrometry techniques were utilized, and a comparison of five older models of “brick” phones and five modern smartphones was conducted. Additionally, 50 kg of PCBs from the current recycling market were analyzed in the same way to create a summary of the current recycling stream. View Full-Text
Keywords: WEEE; PCB; mobile phones; metals; analysis WEEE; PCB; mobile phones; metals; analysis
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MDPI and ACS Style

Gorewoda, T.; Eschen, M.; Charasińska, J.; Knapik, M.; Kozłowicz, S.; Anyszkiewicz, J.; Jadwiński, M.; Potempa, M.; Gawliczek, M.; Chmielarz, A.; Kurylak, W. Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones. Recycling 2020, 5, 20. https://0-doi-org.brum.beds.ac.uk/10.3390/recycling5030020

AMA Style

Gorewoda T, Eschen M, Charasińska J, Knapik M, Kozłowicz S, Anyszkiewicz J, Jadwiński M, Potempa M, Gawliczek M, Chmielarz A, Kurylak W. Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones. Recycling. 2020; 5(3):20. https://0-doi-org.brum.beds.ac.uk/10.3390/recycling5030020

Chicago/Turabian Style

Gorewoda, Tadeusz, Marcus Eschen, Jadwiga Charasińska, Magdalena Knapik, Sylwia Kozłowicz, Jacek Anyszkiewicz, Michał Jadwiński, Martyna Potempa, Marta Gawliczek, Andrzej Chmielarz, and Witold Kurylak. 2020. "Determination of Metals’ Content in Components Mounted on Printed Circuit Boards from End-of-Life Mobile Phones" Recycling 5, no. 3: 20. https://0-doi-org.brum.beds.ac.uk/10.3390/recycling5030020

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