Inkjet Printing for Materials and Devices

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".

Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 698

Special Issue Editor


E-Mail Website
Guest Editor
Laboratory of Applied NanoSciences (COMATEC-LANS), Department of Industrial Technologies, HEIG-VD, HES-SO, University of Applied Sciences and Arts Western Switzerland, CH-1401 Yverdon-les-Bains, Switzerland
Interests: AFM; thin films; transparent electrodes; inkjet printing; nanocomposite materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Inkjet printing and related solution-based dispensing, printing, and coating techniques play today an increasing role in industrial additive manufacturing technologies for advanced materials and for large-scale production of printable devices. Printable functional materials and devices find applications in printed electronics for health and environmental monitoring, as well as in novel materials and device developments for active and smart packaging, medical devices, aeronautics, energy storage, or flexible robotics and sensors. Advanced materials and functional inks, such as hybrid nanocomposites, hybrid colloids, and functional or smart hydrogels exhibiting stimuli-responses, are among exciting recent classes of materials demanding progress in inkjet printing and innovation in related industrial additive manufacturing processes and technologies.

The aim of this Special Issue is thus to bring together researchers working on applications of novel inkjet-printable materials and devices, both at the advanced materials side and at the innovative printing and processing technologies side. The Special issue aims to provide novel insights into technical processes, instrumentation, and applications of inkjet printing and related technologies for advanced printable materials and devices. Both experimental studies and theoretical or numerical ink flow or print-process modeling for inkjet printing and related solution-based dispensing, printing, and additive manufacturing technologies for advanced printable materials and devices are welcome.

Prof. Dr. Silvia Schintke
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • inkjet printing
  • solution-based processing
  • additive manufacturing
  • hybrid inks
  • composites
  • smart hydrogels
  • printing process and technologies
  • process modeling
  • printed electronics
  • flexible devices

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop