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Applied Sciences
Special Issues
Advanced Materials and Reliability for Microelectronics
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Advanced Materials and Reliability for Microelectronics

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".

Deadline for manuscript submissions: closed (30 June 2022) | Viewed by 4690

Special Issue Editors

Dr. Roland Brunner

E-Mail Website
Guest Editor
Materials Center Leoben Forschung GmbH (MCL), 8700 Leoben, Austria
Interests: material and damage analytics; thin films; mechanical properties; laser ultrasound
Special Issues, Collections and Topics in MDPI journals
Dr. Elke Kraker

E-Mail Website
Guest Editor
Materials Center Leoben Forschung GmbH (MCL), 8700 Leoben, Austria
Interests: reliability and analytics for assembly and interconnects; assembly and interconnect technology; reliability testing; microelectronics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We invite you to submit contributions dealing with the design and fabrication of advanced materials for microelectronic applications, as well as the reliability of microelectronic devices and systems. From experimental techniques to data analysis, the scope of the Special Issue is to incorporate and combine topics such as the development and application of (1) experimental methods and methodological workflows for material research and reliability testing, (2) device technology, (3) computational modeling and simulations, as well as (4) advanced data analysis and embedded computing systems incorporating artificial intelligence (AI)-based concepts. The Special Issue shall in particular address industrial relevant research in the field of microelectronics.

Dr. Roland Brunner
Dr. Elke Kraker
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • reliability
  • artificial intelligence
  • interconnects
  • 3D integration
  • thin films
  • porous materials
  • failure analysis
  • assembly and interconnect technology
  • functional materials
  • nanostructure devices and device technology

Published Papers (2 papers)

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Research

8 pages, 8916 KiB  
Article
Accelerated Testing and Reliability of FDM-Based Structural Electronics
by Bartłomiej Wałpuski and Marcin Słoma
Appl. Sci. 2022, 12(3), 1110; https://0-doi-org.brum.beds.ac.uk/10.3390/app12031110 - 21 Jan 2022
Cited by 4 | Viewed by 1344
Abstract
With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded [...] Read more.
With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded into its mechanical construction. This approach has many advantages, but the reliability of systems constructed this way has not been extensively studied so far. In this work, circuits consisting of silver ink conductive traces were printed on FDM polymer substrates, with or without 0 Ω resistors, and were subjected to accelerated aging testing. The samples were divided into three groups, and for each of them, the mean time to failure was calculated, which for the best group was 8000 h. This paper also presents the mechanism that led to the failure of these systems, as well as actions that will lead to the elimination of this phenomenon. Full article
(This article belongs to the Special Issue Advanced Materials and Reliability for Microelectronics)
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10 pages, 2114 KiB  
Article
Electropolishing—A Practical Method for Accessing Voids in Metal Films for Analyses
by Sebastian Moser, Manuel Kleinbichler, Sabine Kubicek, Johannes Zechner and Megan J. Cordill
Appl. Sci. 2021, 11(15), 7009; https://0-doi-org.brum.beds.ac.uk/10.3390/app11157009 - 29 Jul 2021
Cited by 7 | Viewed by 2322
Abstract
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the interior of metal thin films [...] Read more.
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the interior of metal thin films along their lateral direction by material removal. When performed at optimized process parameters, material removal can be well controlled and the surface becomes smooth at the micro scale, resulting in the voids being well distinguishable from the background in scanning electron microscopy images. Compared to conventional cross-sectional sample preparation (embedded mechanical cross-section or focused ion beam), the accessed surface is not constrained by the thickness of the investigated film and laterally resolved void analyses are possible. For demonstrational purposes of this method, the distribution of degradation voids along the metallization of thermo-mechanically stressed microelectronic chips has been quantified. Full article
(This article belongs to the Special Issue Advanced Materials and Reliability for Microelectronics)
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