Dear Colleagues,

We invite you to contribute to a Special Issue of the journal Applied Sciences, “Advances on New Silicon-Integrating Devices: From the Technology of Silicon to the Technology with Silicon”, which aims to present recent advances in next frontiers of silicon technologies and applications that integrate Moore’s Law and the More than Moore concept to write a new paradigm based on the human-driven technology concept. Design and fabrication strategies, modeling and characterization techniques, theoretical studies, and new devices and application fields are welcome.

Since the early 1970s, Moore’s law has driven the semiconductor industry and market relating the continuous increase of products’ performance–to-cost. This has required a great effort from the R&D side, with necessary advances and/or novelties in both the theoretical delineation of such new challenges and in the design and fabrication strategies to their implementation ratio to the transistor scaling down. In the last decade, the end of Moore’s Law, or a revision of its prediction, has moved the industry toward a new trend, “More than Moore”, where added value to devices is provided by incorporating functionalities that do not necessarily scale according to Moore's Law. Now it is time for the next step for the semiconductor industry, the time of a heterogeneous integration of miniaturization and functional diversification, materials, and technologies with the prospective to obtain high-value and potentially human-driven systems. This requires a great effort from the R&D side, with advances and/or novelties in both the theoretical delineation of such new challenges and in the design and fabrication strategies to their implementation. The result will be the ability to identify an increasing number of application sectors, thus becoming increasingly pervasive and indispensable for people’s daily lives.

Dr. Lucanos Marsilio Strambini
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• Silicon
• Silicon-on-insulator
• Porous silicon
• Silicon nanowire
• Silicon-on-nothing
• Silicon carbide
• Low power electronics
• Low voltage devices
• Three-dimensional integrated circuits
• System-in-package
• System-on-chip
• Heterogeneous integration
• Sensors
• Actuators
• Passive components
• Biochips
• Photonic
• Energy harvesting
• Photovoltaics
• Wireless sensor network
• Internet of Things
• Automotive
• Smart cities
• Medicine