Advances in Additive Manufacturing of 2D/3D Electronic Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Additive Manufacturing Technologies".
Deadline for manuscript submissions: closed (20 December 2021) | Viewed by 426
Special Issue Editors
Interests: micro–nano fabrication; additive manufacturing; 3D printing; printed electronics; surface engineering; sensors
Special Issue Information
Dear Colleagues,
We are inviting submissions to a Special Issue on “Advances in Additive Manufacturing of 2D/3D Electronic Applications”.
The new form of industrial production is demanding the generation of new, intelligent manufacturing processes which are more customizable, resuting in smaller production batches and more waste. Additive manufacturing (AM) is seen as a powerful enabler for circular economy, which allows materials to be used as long as possible. Thanks to efforts in both the academic and industrial arenas, more and more advanced technologies and applications in AM have been explored.
This Special Issue is devoted to electronics applications of AM technologies. Printed electronics and 3D printing are typical AM technologies. In addition, more hybrid technologies have been developed. Thus, authors are welcome to demonstrate the benefit of integrating AM and materials development technologies into other advanced manufacturing approaches. Both in situ and post-processing technologies have been developed to fabricate electronic components, which can be applied into the development of functional devices, such as circuits, sensors, flexible electronis, wearable electronics, etc. Applications can range from the microscale to the macroscale and from research to industry.
AM is an essential manufacturing method for future intelligent manufacturing, especially as electronic development can significantly extend AM into more practical applications. Together, we can attract increasing attention from both the research community and the industrial area to this very topical issue.
Dr. Qiuquan Guo
Dr. Dongxing Zhang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 3D printing
- printed electronics
- additive manufacturing
- sensors
- intelligent manufacturing
- flexible electronics
- nanomaterials
