Thermal Management of Power Electronic Components and Systems
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Energy Science and Technology".
Deadline for manuscript submissions: closed (1 February 2022) | Viewed by 1246
Special Issue Editors
Interests: energy system and renewable energy technologies; energy-efficient and sustainable technology; heat transfer and heat exchangers; waste heat recovery and thermal management; industrial modelling, simulation, optimization, and control
Special Issues, Collections and Topics in MDPI journals
Interests: solar energy; solar thermal power; thermal energy storage; hydrogen energy; energy conservation; combined heat and power; district heating; waste heat recovery and thermal management; enhanced heat transfer; microscale heat transfer
Special Issue Information
Dear Colleagues,
To improve the reliability and efficiency of power electronic components and systems, it is important to develop thermal management solutions that can tackle high power densities. In electronic components and systems, the temperature should be maintained below the allowable limit to avoid damage associated with the hot spot. On the other hand, efficient cooling with uniform temperature distribution must be obtained in order to achieve optimal performance. Today, thermal management has become a crucial topic in applications for electronics, especially for those cases with high compactness due to the current trend of miniaturization.
Thermal management involves all the technical solutions in the field of heat generation, control, and dissipation. Over the last two decades, various techniques to improve thermal management have been developed, including conventional ones such as fan, heat pipe, and heat sink, and more innovative ones (such as refrigerant cooling, compact heat exchangers, thermoelectric refrigeration, phase change material, cold plate cooling), as well as the latest ones (such as nanotechnology and smart materials). However, there are still some limitations and challenges. Multiscale approaches are important for studies of novel thermal management since they are able to capture the different length scales involved in the operation and at the same time describe critical parts such as surfaces, defects, interfaces, and on the atomistic, quantum-chemical level. Special attention will be further given to the importance played by radiation in heat dissipation. Additionally, making the leap from the laboratory into commercial devices for any novel thermal management solutions will require them to easily integrate into current industry processes.
The aim of this Special Issue is to provide a forum for a discussion of the advances and new technology development in the thermal management of power electronics. Papers dealing with the aforementioned limitations and challenges are invited. Also relevant are studies about energy efficiency, heat transfer processes (especially studied by an approach that couples experimental measurements with theoretical/numerical modeling), as well as the use of nanofluids, enhanced surfaces, nanocoatings, and phase change materials. All original research papers or letters and short reviews are welcome.
Dr. Hongwei Wu
Prof. Dr. Xiaoze Du
Guest Editors
Manuscript Submission Information
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Keywords
- multiscale heat transfer
- thermal management
- thermal interface
- minichannels
- microchannel flow boiling
- phase change
- liquid cooling
- air cooling
- thermomechanical reliability
- radiation in heat dissipation
- heat pipe
- nano fluid
