Special Issue "System-Integrated Intelligence and Intelligent Systems 2020"

A special issue of Computers (ISSN 2073-431X).

Deadline for manuscript submissions: closed (31 March 2021).

Special Issue Editor

Special Issue Information

Dear Colleagues,

The Special Issue, SI3S (Short Title: “System-Integrated Intelligence and Intelligent Systems”), will be linked to the 5th International Conference on System-Integrated Intelligence (SysInt 2020, see www.sysint-conference.org). On the one hand, it will gather the top contributions presented at this event, and on the other hand, is an open call for outstanding submissions.

The conference itself provided a forum for academia and industry to present their latest research findings, innovations, and practices in the field of system-integrated intelligence. It focused on the integration of advanced functional capabilities into materials, systems, parts, and products as an enabling technology for established application scenarios, as well as new products and services. The perspectives are highly interdisciplinary. The technological basis extends from new sensor technologies via material-integrated sensing and intelligence to aspects of communication and data evaluation. It includes the implementation of such approaches in autonomous decision-making, self-optimization, and control in advanced engineering products and systems.

The conference further addressed wider fields of research, such as materials science and engineering, microsystems technology, mechatronic systems, and production engineering, as well as electronics and computer science. Specific application environments in the field of robotics, structural health monitoring, production, and logistics were highlighted in the program through the definition of dedicated symposia. Studies on implementation of system-integrated intelligence in additional scenarios beyond this scope are highly welcome.

Individual topics of interest include but are not limited to:

  1. Intelligent Systems: Enabling Technologies and Artificial Intelligence
    • Agent-based planning and reasoning
    • Applied machine learning and data mining
    • Self-* systems (*: adaptivity, awareness, configuration, connectivity, learning, coordination)
    • Knowledge-based systems
    • Cloud-based computing and manufacturing
  2. The Future of Manufacturing: Cyberphysical Production and Logistic Systems
  3. Pervasive and Ubiquitous Computing
    • Agent-based computing and agent-based simulation
    • Agent processing platforms
    • Distributed embedded and mobile systems
    • Ad-hoc and mobile networks
    • Sensor networks (large-scale, material-applied or material-integrated, low-power, smart dust)
    • Crowd and mobile sensing
    • Smart sensors
    • Smart cities
    • Smart energy management (in sensor networks)
    • Data mining from sensor data
  4. Structural Health Monitoring
    • Machine learning
    • Data mining
    • Sensor processing
  5. Systems Engineering of Smart Sensors, Sensor Networks, Devices, Machines, and IoT
  6. Soft Robotics and Human–Machine Interaction

Dr. Stefan Bosse
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Computers is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (4 papers)

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Research

Article
Product Lifecycle Management with the Asset Administration Shell
Computers 2021, 10(7), 84; https://0-doi-org.brum.beds.ac.uk/10.3390/computers10070084 - 23 Jun 2021
Viewed by 714
Abstract
Product lifecycle management (PLM) as a holistic process encompasses the idea generation for a product, its conception, and its production, as well as its operating phase. Numerous tools and data models are used throughout this process. In recent years, industry and academia have [...] Read more.
Product lifecycle management (PLM) as a holistic process encompasses the idea generation for a product, its conception, and its production, as well as its operating phase. Numerous tools and data models are used throughout this process. In recent years, industry and academia have developed integration concepts to realize efficient PLM across all domains and phases. However, the solutions available in practice need specific interfaces and tend to be vendor dependent. The Asset Administration Shell (AAS) aims to be a standardized digital representation of an asset (e.g., a product). In accordance with its objective, it has the potential to integrate all data generated during the PLM process into one data model and to provide a universally valid interface for all PLM phases. However, to date, there is no holistic concept that demonstrates this potential. The goal of this research work is to develop and validate such an AAS-based concept. This article demonstrates the application of the AAS in an order-controlled production process, including the semi-automatic generation of PLM-related AAS data. Furthermore, it discusses the potential of the AAS as a standard interface providing a smooth data integration throughout the PLM process. Full article
(This article belongs to the Special Issue System-Integrated Intelligence and Intelligent Systems 2020)
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Article
Functional Design Employing Miniaturized Electronics with Wireless Signal Provision to a Smartphone for a Strain-Based Measuring System for Ski Poles
Computers 2021, 10(6), 77; https://0-doi-org.brum.beds.ac.uk/10.3390/computers10060077 - 11 Jun 2021
Viewed by 615
Abstract
The individual monitoring of cross-country skiers’ technique-related parameters is crucial to identifying possible athlete-individual deficits that need to be corrected in order to optimize the athlete’s performance in competition. To be able to record relevant biomechanical parameters during training in the field, the [...] Read more.
The individual monitoring of cross-country skiers’ technique-related parameters is crucial to identifying possible athlete-individual deficits that need to be corrected in order to optimize the athlete’s performance in competition. To be able to record relevant biomechanical parameters during training in the field, the development of measuring systems exploiting the athlete’s full potential is the key. Known mobile monitoring systems for measuring forces on ski poles use comparably heavy uniaxial load cells mounted on the pole with a data logger also attached to the pole or carried by the athlete. Measurements that are more accurate can be acquired using wire-based systems. However, wire-based systems are highly immobile and only usable when the athletes undergo a stationary test, e.g., on a treadmill. This paper focuses on the functional design of a measuring system using specialized, miniaturized electronics for acquiring data from strain sensors. These data are then used to determine the technique-related parameters pole force and angle of bend. The functional design is also capable of transmitting the acquired data wirelessly via Bluetooth to a smartphone that runs a proprietary app. This approach is advantageous regarding mass, dynamic behavior, analyzing functionality, and signal processing compared to the state of the art. Full article
(This article belongs to the Special Issue System-Integrated Intelligence and Intelligent Systems 2020)
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Article
EIPPM—The Executable Integrative Product-Production Model
Computers 2021, 10(6), 72; https://0-doi-org.brum.beds.ac.uk/10.3390/computers10060072 - 27 May 2021
Viewed by 687
Abstract
In this paper, a combination of graph-based design and simulation-based engineering (SBE) into a new concept called Executable Integrative Product-Production Model (EIPPM) is elaborated. Today, the first collaborative process in engineering for all mechatronic disciplines is the virtual commissioning phase. The authors see [...] Read more.
In this paper, a combination of graph-based design and simulation-based engineering (SBE) into a new concept called Executable Integrative Product-Production Model (EIPPM) is elaborated. Today, the first collaborative process in engineering for all mechatronic disciplines is the virtual commissioning phase. The authors see a hitherto untapped potential for the earlier, integrated and iterative use of SBE for the development of production systems (PS). Seamless generation of and exchange between Model-, Software- and Hardware-in-the-Loop simulations is necessary. Feedback from simulation results will go into the design decisions after each iteration. The presented approach combines knowledge of the domain “PSs” together with the knowledge of the corresponding “product” using a so called Graph-based Design Language (GBDL). Its central data model, which represents the entire life cycle of product and PS, results of an automatic translation step in a compiler. Since the execution of the GBDL can be repeated as often as desired with modified boundary conditions (e.g., through feedback), a design of experiment is made possible, whereby unconventional solutions are also considered. The novel concept aims at the following advantages: Consistent linking of all mechatronic disciplines through a data model (graph) from the project start, automatic design cycles exploring multiple variants for optimized product-PS combinations, automatic generation of simulation models starting with the planning phase and feedback from simulation-based optimization back into the data model. Full article
(This article belongs to the Special Issue System-Integrated Intelligence and Intelligent Systems 2020)
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Article
Systematic Design Approach for Functional Integration of Vehicular Wireless Power Transfers Modules
Computers 2021, 10(5), 61; https://0-doi-org.brum.beds.ac.uk/10.3390/computers10050061 - 07 May 2021
Viewed by 548
Abstract
This paper presents a systematic design approach to the development of functionally integrated mechanical-electrical lightweight systems. The development of these systems requires the end-to-end consideration of all product domains involved, aspects of lightweight design and their mutual interdependencies. To manage this complexity, a [...] Read more.
This paper presents a systematic design approach to the development of functionally integrated mechanical-electrical lightweight systems. The development of these systems requires the end-to-end consideration of all product domains involved, aspects of lightweight design and their mutual interdependencies. To manage this complexity, a specialized approach is developed, which extends the V-model of VDI 2206 problem-specific and purpose-oriented. In line with the proposed approach, this work presents the conception and evaluation of three functionally integrated on-board receiver units of automotive wireless power transfer systems for electric vehicles. These concepts provide a significant reduction of the vertical dimensions, which significantly increases the applicability and transferability of wireless power transfer systems. Full article
(This article belongs to the Special Issue System-Integrated Intelligence and Intelligent Systems 2020)
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