Special Issue "3D Printing Functionality: Materials, Sensors, Electromagnetics"
Deadline for manuscript submissions: closed (15 May 2021).
Recently, there has been a rise in the commercial, industrial, and academic interest in the rapid prototyping technology, commonly referred to as additive manufacturing and 3D printing. Traditionally, additive technologies have been limited to purely mechanical applications. However, in recent years there has been a surge in advanced manufacturing investigations ranging from printed sensors and antennas to chemical and thermal functional materials. This additional functionality, incorporated with the ease and speed of traditional additive techniques, has the potential to revolutionize the production processes. It is expected that advances in functional printing techniques will drastically reduce time-to-market as well as improve overall device functionality. As such, this Special Issue is intended to examine new techniques, designs, and processes that improve the functionality of printable and 3D printable devices or material systems. Of particular interest are topics that incorporate multiple means of functionality, whether through mechanical, thermal, electromagnetic, electrical, or chemical means.
Prof. Dr. Corey Shemelya
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Designs is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- printable materials
- 3D printing
- rapid prototyping
- structural electronics