Recent Methodologies for Reliability Modeling, Design and Control of Intelligent Mechatronic Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Systems & Control Engineering".

Deadline for manuscript submissions: closed (15 August 2021) | Viewed by 11403

Special Issue Editors


E-Mail Website
Guest Editor
NCBS Lab, School of Electronics Engineering, Kyungpook National University, Daegu 41566, Korea
Interests: onlinear estimation and filtering; sliding-mode control; vehicle dynamics and control; autonomous vehicle control; AI; signal processing
Special Issues, Collections and Topics in MDPI journals

E-Mail Website1 Website2
Guest Editor
Department of Automation, East China University of Science and Technology, No. 130 Meilong Road, Shanghai 200237, China
Interests: distributed control systems; artificial intelligence; control systems; applications to robotic systems; power grids; safety monitoring

Special Issue Information

Dear Colleagues,

Intelligent mechatronic systems (IMS), such as intelligent vehicles/robots/transportation systems, are generally complex due to the integration of artificial intelligence and multidisciplinary features taken from mechanical engineering, electrical engineering, and control engineering. This integrated complexity leads to challenges in reliability modeling and reliability testing due to different and complex failure modes. To achieve reliability requirements, reliability design and resilient control are critical for the development of IMS. Given the advances in information and network techniques, it is then opportunistic to exploit them for the benefit of reliability design and resilient control.

The main focus of this Special Issue will be on the new techniques in reliability modeling, reliability analysis, reliability design, fault and failure detection, signal processing, and resilient control of IMS. This Special Issue provides a platform to share the most recent developments in the fields of reliability design and resilient control. Solicited papers must bring new ideas and approaches, clearly indicating the advances made through problem statements and methodologies with applications to modern complex systems.

Following the conference IFAC WC2020, the 21st IFAC World Congress, held in Berlin, Germany, on 12–17 July 2019, the authors of papers presented on the above topics at IFAC WC2020 are now invited to submit the extended versions to this Special Issue. Submitted papers should be extended to the size of regular research or review articles, and represent an at least a 50% extension in new results.

Topics of interest include but are not limited to the following:

  • Advanced reliability modeling and identification;
  • Robust control and filtering issues in IMS;
  • Failure analysis and prediction methods;
  • Fault diagnosis and fault tolerant control of IMS;
  • Risk analysis and management;
  • Architectural framework of reliability design;
  • Non-fragile and resilient control design;
  • Recent developments on model based and data-driven techniques in IMS;
  • Soft computing methods for fault detection and isolation (FDI) of IMS;
  • Application studies;
Prof. Dr. Hamid Reza Karimi
Prof. Dr. Kalyana C. Veluvolu
Prof. Dr. Yang Tang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (3 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

13 pages, 7392 KiB  
Article
Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics
by Soonwan Chung and Jae B. Kwak
Electronics 2020, 9(9), 1515; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics9091515 - 15 Sep 2020
Cited by 10 | Viewed by 4018
Abstract
In this paper, drop reliability of various PBA (printed board assembly) mounting structures is investigated and compared. Then, we built SAC305 (Sn3.0Ag0.5Cu) interconnects for BGA (ball grid array) package failure model to evaluate the drop impact reliability of handheld devices. In order to [...] Read more.
In this paper, drop reliability of various PBA (printed board assembly) mounting structures is investigated and compared. Then, we built SAC305 (Sn3.0Ag0.5Cu) interconnects for BGA (ball grid array) package failure model to evaluate the drop impact reliability of handheld devices. In order to simulate actual behavior of the solder joint under the drop impact load of handheld devices, we perform explicit full FEA (finite element analysis) modeling. However, this takes a lot of computing time because of the large aspect ratio of element size between solder joints and other structures such as PCB (printed circuit board) and electronic packages. Therefore, an effective way to represent solder interconnects for FEA is needed which would be relatively simpler yet detailed. Comparable board-level drop tests are conducted after equipping test vehicles with various fixtures considering PBA mounting structures, which make it possible to apply different loading conditions to BGA packages. The results show different drop impact life for solder interconnects depending on the mounting design of the PBA. Particularly, the solder interconnect of the component located at the middle of the PCB exhibits the shortest impact life where the highest tensile stress occurs. Also, the mounting design restraining PBA deflections shows better reliability under the drop impact loading. Sequentially, simulating with a PBA composed of the BGA package and the PCB is considered to assess the feasibility of the solder ball failure modeling when the drop impact load is applied. Especially, for the modeling of the solder balls, detailed solid model and simple beam model are compared regarding computational efficiency and numerical accuracy. We found that the simple beam model significantly shortens computational time from 110 h to less than an hour. Accordingly, the feasibility of the beam model for the solder balls is shown by correlating the stress level and the drop impact life obtained from the experiments. Full article
Show Figures

Figure 1

22 pages, 12770 KiB  
Article
Modeling and Stability Analysis of Coarse–Fine Composite Mechatronic System in UAV Multi-Gimbal Electro-Optical Pod
by Cheng Shen, Ning Chen, Ruoyu Tan, Shixun Fan and Dapeng Fan
Electronics 2020, 9(5), 769; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics9050769 - 07 May 2020
Cited by 4 | Viewed by 3199
Abstract
Coarse–fine composite mechatronic systems face numerous challenges due to the structural complexity and diversification of multi-gimbals. The core goal of this manuscript is to address the issue of the coarse-fine composite mechatronic system stability of a UAV (unmanned aerial vehicle) multi-gimbal electro-optical pod [...] Read more.
Coarse–fine composite mechatronic systems face numerous challenges due to the structural complexity and diversification of multi-gimbals. The core goal of this manuscript is to address the issue of the coarse-fine composite mechatronic system stability of a UAV (unmanned aerial vehicle) multi-gimbal electro-optical pod using USM-VCM (ultrasonic motor and voice coil motor) mechatronic design, Euler dynamics modeling, and stability DOB (disturbance observer) control. In response to this problem, a Hall effect electromagnetic circuit and USM-VCM drive acquisition circuit are designed. A Euler dynamics model in the Cartesian coordinate system is built to derive the kinematics coupling compensation matrix and mechanical parameter optimization method between the gimbals. Finally, the model is substituted into the DOB suppression control, which can monitor and compensate the motion coupling between the coarse–fine composite mechatronic systems in real time. Results show that the disturbance suppression impact of the DOB method with the Euler optimization model and USM-VCM mechatronic design is increased by up to 90% compared to the PID (proportion integration differentiation) method and 20% better than the traditional DOB method. Full article
Show Figures

Figure 1

15 pages, 7200 KiB  
Article
A Novel Changing Athlete Body Real-Time Visual Tracking Algorithm Based on Distractor-Aware SiamRPN and HOG-SVM
by Mingwei Sheng, Weizhe Wang, Hongde Qin, Lei Wan, Jun Li and Weilin Wan
Electronics 2020, 9(2), 378; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics9020378 - 24 Feb 2020
Cited by 6 | Viewed by 3370
Abstract
Athlete detection in sports videos is a challenging task due to the dynamic and cluttered background. Distractor-aware SiamRPN (DaSiamRPN) has a simple network structure and can be utilized to perform long-term tracking of large data sets. However, similarly to the Siamese network, the [...] Read more.
Athlete detection in sports videos is a challenging task due to the dynamic and cluttered background. Distractor-aware SiamRPN (DaSiamRPN) has a simple network structure and can be utilized to perform long-term tracking of large data sets. However, similarly to the Siamese network, the tracking results heavily rely on the given position in the initial frame. Hence, there is a lack of solutions for some complex tracking scenarios, such as running and changing of bodies of athletes, especially in the stage from squatting to standing to running. The Haar feature-based cascade classifier is involved to catch the key frame, representing the video frame of the most dramatic changes of the athletes. DaSiamRPN is implemented as the tracking method. In each frame after the key frame, a detection window is given based on the bounding box generated by the DaSiamRPN tracker. In the new detection window, a fusion method (HOG-SVM) combining features of Histograms of Oriented Gradients (HOG) and a linear Support-Vector Machine (SVM) is proposed for detecting the athlete, and the tracking results are updated in real-time by fusing the tracking results of DaSiamRPN and HOG-SVM. Our proposed method has reached a stable and accurate tracking effect in testing on men’s 100 m video sequences and has realized real-time operation. Full article
Show Figures

Figure 1

Back to TopTop