Advances in Thermal Interface Materials (TIMs) with 2D Fillers
A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "D1: Advanced Energy Materials".
Deadline for manuscript submissions: closed (28 February 2022) | Viewed by 2348
Special Issue Editor
Interests: 2D materials; nanomaterials; polymer nanocomposites; fiber-reinforced composites; printed and flexible electronics; printing and coating technology; lightweighting; renewable energy; sustainability
Special Issue Information
Dear Colleagues,
Thermal management requirements have been increasing rapidly in the past few decades with the developments in consumer electronics. Faster microprocessors, high-powered LEDs, battery and photovoltaic modules, and 5G communication systems are examples of only some of the applications that require more efficient thermal interface materials (TIMs). We have also seen significant research progress in the last decade in TIMs enhanced by 2D crystals. Graphene and hexagonal boron nitride offer high thermal conductivity, surface area, and aspect ratio etc., which make them some of the most promising nanofillers for the next generation of TIMs.
The aim of this Special Issue is to capture the latest advances in the area of polymer as well as metal matrix composite TIMs enhanced with 2D fillers. Contributions on synergistic property enhancements obtained from 0D and 3D combined with 2D fillers are also welcomed. Hence, we encourage authors to submit details of their latest achievements to this Special Issue. Original research articles, review articles, as well as short communications are invited.
Dr. Panagiotis Karagiannidis
Guest Editor
Manuscript Submission Information
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Keywords
- graphene
- boron nitride
- hybrid fillers including ceramic, e.g., aluminum oxide
- polymer matrix nanocomposites
- thermal pastes, adhesive tapes, greases, etc.
- thermal conductivity
- adhesion strength, hardness, elastic modulus, tensile strength
- processing, viscosity, ease of application
- thermal management
- thermal percolation
- synergistic enhancement
- interfacial resistance
- compressible interface materials
- long-term stability and reliability