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Energies
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Heat Transfer and Thermal Management: From Nano to Micro-Scale
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Heat Transfer and Thermal Management: From Nano to Micro-Scale

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: closed (10 January 2023) | Viewed by 10070

Special Issue Editors

Dr. Emigdio Chávez-Ángel

E-Mail Website
Guest Editor
Catalan Institute of Nanoscience and Nanotechnology (ICN2), CSIC and BIST, Campus UAB, Bellaterra, 08193 Barcelona, Spain
Interests: thermal management; thermoelectric materials
Special Issues, Collections and Topics in MDPI journals
Dr. Jérémie Maire

E-Mail Website
Guest Editor
I2M, UMR 5295, CNRS-UB-ENSAM, 33405 Talence, France
Interests: nanoscale thermal transport

Special Issue Information

Dear Colleagues,

From hyperthermia processes in biology to boolean operations with thermal carriers in material science, heat is generated in all daily activities, which requires innovative thermal management solutions. In this sense, the understanding of heat propagation and the ability to tune the thermal properties of materials constitutes a topic of continuous and active research motivated by the increasing importance of thermal management and ways to recover waste heat energy. Heat transfer and thermal management is a very dynamic field that has gained attention in different research communities at different length and time scales. This renewed interest in thermal transport has introduced a number of novel concepts such as radiative cooling, thermal metamaterials, thermodynamic transformations, thermal levitation, coherent and ballistic thermal transport, and thermal gates, to cite a few. 

This Special Issue of Energies will cover the most recent advances in “Heat Transfer and Thermal Management: From Nano- to Microscale”. The topics of interest include but are not limited to: micro and nanoengineering of thermal properties, development and improvements of characterization techniques, numerical simulations and theoretical modeling, thermal cooling, insulation and radiation, phonon dynamics, thermal interface and phase change materials, thermodynamic transformations, thermoelectric generation, and nanofluids.

Dr. Emigdio Chávez-Ángel
Dr. Jérémie Maire
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Thermal cooling and insulation
  • Interface thermal resistance
  • Phase change materials
  • Thermal characterization techniques
  • Thermodynamic transformations
  • Non-Fourier transport
  • Thermoelectricity
  • Phonon dynamics
  • 2D heterostructures

Published Papers (4 papers)

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Research

11 pages, 3811 KiB  
Article
Improved Electrical and Thermal Conductivities of Graphene–Carbon Nanotube Composite Film as an Advanced Thermal Interface Material
by Youcheng Jiang, Shangzhi Song, Mengjuan Mi, Lixuan Yu, Lisha Xu, Puqing Jiang and Yilin Wang
Energies 2023, 16(3), 1378; https://0-doi-org.brum.beds.ac.uk/10.3390/en16031378 - 30 Jan 2023
Cited by 6 | Viewed by 1969
Abstract
Thermal management has become a crucial issue for the rapid development of electronic devices, and thermal interface materials (TIMs) play an important role in improving heat dissipation. Recently, carbon−based TIMs, including graphene, reduced graphene oxide, and carbon nanotubes (CNTs) with high thermal conductivity, [...] Read more.
Thermal management has become a crucial issue for the rapid development of electronic devices, and thermal interface materials (TIMs) play an important role in improving heat dissipation. Recently, carbon−based TIMs, including graphene, reduced graphene oxide, and carbon nanotubes (CNTs) with high thermal conductivity, have attracted great attention. In this work, we provide graphene−carbon nanotube composite films with improved electrical and thermal conductivities. The composite films were prepared from mixed graphene oxide (GO) and CNT solutions and then were thermally reduced at a temperature greater than 2000 K to form a reduced graphene oxide (rGO)/CNT composite film. The added CNTs connect adjacent graphene layers, increase the interlayer interaction, and block the interlayer slipping of graphene layers, thereby improving the electrical conductivity, through−plane thermal conductivity, and mechanical properties of the rGO/CNT composite film at an appropriate CNT concentration. The rGO/CNT(4:1) composite film has the most desired properties with an electrical conductivity of ~2827 S/cm and an in−plane thermal conductivity of ~627 W/(m·K). The produced rGO/CNT composite film as a TIM will significantly improve the heat dissipation capability and has potential applications in thermal management of electronics. Full article
(This article belongs to the Special Issue Heat Transfer and Thermal Management: From Nano to Micro-Scale)
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10 pages, 2021 KiB  
Article
Thermal Rectification and Thermal Logic Gates in Graded Alloy Semiconductors
by Ryan C. Ng, Alejandro Castro-Alvarez, Clivia M. Sotomayor-Torres and Emigdio Chávez-Ángel
Energies 2022, 15(13), 4685; https://0-doi-org.brum.beds.ac.uk/10.3390/en15134685 - 26 Jun 2022
Cited by 4 | Viewed by 1493
Abstract
Classical thermal rectification arises from the contact between two dissimilar bulk materials, each with a thermal conductivity (k) with a different temperature dependence. Here, we study thermal rectification in a Si(1−x)Gex alloy with a spatial dependence [...] Read more.
Classical thermal rectification arises from the contact between two dissimilar bulk materials, each with a thermal conductivity (k) with a different temperature dependence. Here, we study thermal rectification in a Si(1−x)Gex alloy with a spatial dependence on the atomic composition. Rectification factors (R = kmax/kmin) of up to 3.41 were found. We also demonstrate the suitability of such an alloy for logic gates using a thermal AND gate as an example by controlling the thermal conductivity profile via the alloy composition. This system is readily extendable to other alloys, since it only depends on the effective thermal conductivity. These thermal devices are inherently advantageous alternatives to their electric counterparts, as they may be able to take advantage of otherwise undesired waste heat in the surroundings. Furthermore, the demonstration of logic operations is a step towards thermal computation. Full article
(This article belongs to the Special Issue Heat Transfer and Thermal Management: From Nano to Micro-Scale)
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11 pages, 4639 KiB  
Article
Heat Transport Driven by the Coupling of Polaritons and Phonons in a Polar Nanowire
by Yangyu Guo, Masahiro Nomura, Sebastian Volz and Jose Ordonez-Miranda
Energies 2021, 14(16), 5110; https://0-doi-org.brum.beds.ac.uk/10.3390/en14165110 - 19 Aug 2021
Cited by 3 | Viewed by 1730
Abstract
Heat transport guided by the combined dynamics of surface phonon-polaritons (SPhPs) and phonons propagating in a polar nanowire is theoretically modeled and analyzed. This is achieved by solving numerically and analytically the Boltzmann transport equation for SPhPs and the Fourier’s heat diffusion equation [...] Read more.
Heat transport guided by the combined dynamics of surface phonon-polaritons (SPhPs) and phonons propagating in a polar nanowire is theoretically modeled and analyzed. This is achieved by solving numerically and analytically the Boltzmann transport equation for SPhPs and the Fourier’s heat diffusion equation for phonons. An explicit expression for the SPhP thermal conductance is derived and its predictions are found to be in excellent agreement with its numerical counterparts obtained for a SiN nanowire at different lengths and temperatures. It is shown that the SPhP heat transport is characterized by two fingerprints: (i) The characteristic quantum of SPhP thermal conductance independent of the material properties. This quantization appears in SiN nanowires shorter than 1 μm supporting the ballistic propagation of SPhPs. (ii) The deviation of the temperature profile from its typical linear behavior predicted by the Fourier’s law in absence of heat sources. For a 150 μm-long SiN nanowire maintaining a quasi-ballistic SPhP propagation, this deviation can be as large as 1 K, which is measurable by the current state-of-the-art infrared thermometers. Full article
(This article belongs to the Special Issue Heat Transfer and Thermal Management: From Nano to Micro-Scale)
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13 pages, 24737 KiB  
Article
Interfacial Thermal Conductance across Graphene/MoS2 van der Waals Heterostructures
by Shuang Wu, Jifen Wang, Huaqing Xie and Zhixiong Guo
Energies 2020, 13(21), 5851; https://0-doi-org.brum.beds.ac.uk/10.3390/en13215851 - 09 Nov 2020
Cited by 15 | Viewed by 3980
Abstract
The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained [...] Read more.
The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained the thermal conductivity (K) and interfacial thermal conductance (G) via MD simulations. The predicted Κ of monolayer graphene and monolayer MoS2 reached 1458.7 W/m K and 55.27 W/m K, respectively. The thermal conductance across the graphene/MoS2 interface was calculated to be 8.95 MW/m2 K at 300 K. The G increases with temperature and the interface coupling strength. Finally, the phonon spectra and phonon density of state were obtained to analyze the changing mechanism of thermal conductivity and thermal conductance. Full article
(This article belongs to the Special Issue Heat Transfer and Thermal Management: From Nano to Micro-Scale)
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