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Advances in Functional Conductive 3D Printed Nanomaterials and Nanostructures

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: closed (20 February 2022) | Viewed by 5028

Special Issue Editors


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Guest Editor
Institute of Nanotechnology and Materials Engineering, Faculty of Applied Physics and Mathematics, Gdansk University of Technology, 80-233 Gdansk, Poland
Interests: applied electrochemistry; corrosion science; surface engineering; surface chemistry; non-stationary processes
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Guest Editor
Department of Metrology and Optoelectronics, Faculty of Electronics, Telecommunications and Informatics Gdansk University of Technology, Gdansk, Poland
Interests: CVD diamond; nanodiamond; doped nanocarbons; electrochemichal sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Additive manufacturing in the form of 3D printing was first developed in a process known as stereolitography (SLA), which was shortly after followed by subsequent developments such as digital light processing (DLP), fused deposition modelling (FDM), selective laser sintering (SLS), inkjet printing, contour crafting (CC), and many others. 3D printing involves various methods, materials, and equipment. Additive manufacturing technologies have been widely applied in many branches of industry, such as industrial design and construction, automobiles, architecture, mechanical engineering, prototyping, biomedical and biomechanical engineering, etc.

Currently, there is a growing trend of interest in novel filaments for 3D printing with conductive fillers, their modification, and their post-printing treatment. The electroactive response of such materials can be significantly increased by tailoring composite properties and modifying fillers and suitable plasticizers. Conductive nanomaterials and their application in 3D-printed flexible electronics and electrochemical devices, with a particular emphasis on inks based on metal nanoparticles and nanowires, nanocarbons, or graphene sheets, are also the topic of this Issue. In parallel, complex optical devices are also 3D printed using various technologies and experimentally demonstrated by evaluating surface roughness and shape. Various polymer smoothing techniques are studied to improve surface quality for optics. Thus, many new applications are emerging on a daily basis, as novel materials and 3D printing methods are continuously being developed, expanding the general accessibility of additive manufacturing techniques.

It is our pleasure to invite you to submit a manuscript to this Special Issue focused on 3D-printing technologies, materials, and printouts designed for customized applications. Full papers, communications, and reviews on fabrication and manufacturing, properties, and applications of advances in additive manufacturing are all welcome.

Assoc. Prof. Jacek Ryl
Assoc. Prof. Robert Bogdanowicz
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D printing
  • Nanomaterials
  • Fused deposition modelling
  • Stereolitography
  • Selective laser sintering
  • Customized materials
  • Flexible electronics
  • 3D printed electrodes
  • 3D printed optics.

Published Papers (2 papers)

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Research

9 pages, 1057 KiB  
Article
Printed Flexible Thermoelectric Nanocomposites Based on Carbon Nanotubes and Polyaniline
by Marcin Słoma, Maciej Andrzej Głód and Bartłomiej Wałpuski
Materials 2021, 14(15), 4122; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14154122 - 24 Jul 2021
Cited by 9 | Viewed by 1984
Abstract
A new era of composite organic materials, nanomaterials, and printed electronics is emerging to the applications of thermoelectric generators (TEGs). Special attention is focused on carbon nanomaterials and conducting polymers, and the possibility to form pastes and inks for various low-cost deposition techniques. [...] Read more.
A new era of composite organic materials, nanomaterials, and printed electronics is emerging to the applications of thermoelectric generators (TEGs). Special attention is focused on carbon nanomaterials and conducting polymers, and the possibility to form pastes and inks for various low-cost deposition techniques. In this work, we present a novel approach to the processing of composite materials for screen-printing based on carbon nanotubes (CNTs) and polyaniline (PANI), supported with a dielectric polymer vehicle. Three different types of such tailor-made materials were prepared, with a functional phase consisted of carbon nanotubes and polyaniline composites fabricated with two methods: dry mixing of PANI CNT powders and in situ polymerisation of PANI with CNT. These materials were printed on flexible polymer substrates, exhibiting outstanding mechanical properties. The best parameters obtained for elaborated materials were σ=405.45 S·m1, S=15.4 μV·K1, and PF=85.2 nW·m1K2, respectively. Full article
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15 pages, 6008 KiB  
Article
Soldering of Electronics Components on 3D-Printed Conductive Substrates
by Bartłomiej Podsiadły, Andrzej Skalski and Marcin Słoma
Materials 2021, 14(14), 3850; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14143850 - 09 Jul 2021
Cited by 3 | Viewed by 2398
Abstract
Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One [...] Read more.
Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components. Full article
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