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Materials
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The Composition and Photoelectrochemical Performance of Thin Films
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The Composition and Photoelectrochemical Performance of Thin Films

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 4207

Special Issue Editors

Dr. Adam Cenian

E-Mail Website
Guest Editor
Physical Aspects of Ecoenergy Department, Institute of Fluid-Flow Machinery, Polish Academy of Sciences, Gdańsk, Poland
Interests: plasma; plasma-chemistry; plasma diagnostics; laser technologies; nanotechnologies; PV; energy transfer processes; ecoenergetics
Dr. Katarzyna Siuzdak

E-Mail Website
Guest Editor
The Szewalski Institute of Fluid-Flow Machinery of the Polish Academy of Sciences (IMP PAN), Gdansk, Poland
Interests: nanostructured materials; ordered titania nanotubes; photoelectrochemical activity; laser surface modification; electrochemical deposition; water splitting; photovoltaic cells
Special Issues, Collections and Topics in MDPI journals
Dr. Miroslaw Sawczak

E-Mail Website
Guest Editor
Robert Szewalski Institute of Fluid-Flow Machinery of the Polish Academy of Sciences, Gdansk, Poland
Interests: laser technologies; nanomaterials; nondestructive analytical techniques; thin film deposition; spectroscopy

Special Issue Information

Dear Colleagues,

Materials, a peer-reviewed open access journal of materials science and engineering, plans to publish a Special Issue titled “The Composition and Photoelectrochemical Performance of Thin Films.” The main aim of this Special Issue is to serve scientists and engineers active in the fields of thin-film synthesis and its diagnostics, surface science, nanostructures (chemical composition, crystal phase) and finally their characterization (including composition and photoelectrochemical performance) and applications.

The scope of the Special Issue includes results of materials science, specific surface analytical techniques, theoretical and computational methods, the processing of films and nanostructures and applied physics, with special emphasis on the following topics:

  • Deposition techniques, growth and characterization of thin films
  • Thin film, surfaces and interfaces
  • Photoactive thin films and energy harvesting
  • Langmuir-Blodgett and Related Films
  • Nanostructured thin films and surfaces, including manipulation of matter at atomic/molecular scale and assembly phenomena (2D assembly)
  • Condensed Matter Film Behaviour
  • Mechanics and nanomechanics of thin films
  • Theoretical calculations/modelling of thin films
  • Electronics, Optics, and Opto-electronics of thin films
  • Surface modification by laser radiation, ion, electron beams and plasma interactions
  • Thin Film Devices, Sensors, and Actuators
  • Surface science of catalysis, electrocatalysis and photocatalysis, chemistry at electrified interfaces
  • Surface nano-engineering and functionalization,
  • Thin films application for energy conversion and storage

The deposition processes may include: pulsed laser deposition, physical and chemical vapour deposition, thermal and plasma spraying, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. Tribology and bio surfaces are not in the issue’s scope. Special attention should be paid to the material response during its exposure to the whole solar spectrum or the particular wavelengths.

Work published in Materials reaches a wide range of specialists, in fields ranging from chemistry and physics to biology, materials science and engineering. The Special Issue will provide an excellent forum for cross-fertilization of ideas and broad dissemination of presented results. We expect contributions to range from original scientific articles concerned with applied research or direct applications of thin films, as well as reviews of current technology in specific areas (in the latter case please send your proposal beforehand).

Papers should comply with the general journal requirements as described at https://0-www-mdpi-com.brum.beds.ac.uk/journal/materials/instructions

It is my pleasure to invite you to submit a manuscript for this Special Issue of Materials. Fundamental, interdisciplinary, theoretical, experimental and applied work will be considered. You are encouraged to write articles that are of relevance and interest to both established surface scientists and newcomers to the field.

Prof. Dr. Adam Cenia
Dr. Katarzyna Siuzdak
Dr. Mirosław Sawczak
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thin films and surfaces
  • deposition techniques
  • film growth
  • energy harvesting
  • photoactive thin films
  • nanostructured thin films
  • 2D assembly
  • nanomechanics of Thin Layers
  • opto-electronics of thin films
  • electronics of thin films
  • optics of thin films
  • film modification
  • thin film devices
  • thin film sensors
  • thin film actuators
  • surface nano-engineering
  • surface functionalization
  • thin films application
  • surface reactivity
  • functional surfaces
  • electrochemistry at surfaces

Published Papers (2 papers)

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Research

9 pages, 1078 KiB  
Article
In Situ Analyses of Surface-Layer Composition of CxNy Thin Films Using Methods Based on Penning Ionization Processes—Introductory Investigations
by Galina Grigorian, Izabela Konkol and Adam Cenian
Materials 2021, 14(24), 7812; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14247812 - 17 Dec 2021
Viewed by 1465
Abstract
Carbon nitride materials have received much attention due to their excellent tribological, mechanical and optical properties. It was found that these qualities depend on the N/C ratio; therefore, the possibility to control it in situ in the sputtered film is of high importance. [...] Read more.
Carbon nitride materials have received much attention due to their excellent tribological, mechanical and optical properties. It was found that these qualities depend on the N/C ratio; therefore, the possibility to control it in situ in the sputtered film is of high importance. The plasma-electron spectroscopy method based on the Penning ionization process analysis is developed here to control this ratio in CNx films produced by plasma-sputtering in a pulsed-periodic regime of glow discharge. The electron energy distribution function is determined by the means of a single Langmuir probe placed in the center of the discharge tube. The mixture N2:CH4:He was used in the process of sputtering. The applied concentrations of CH4 varied in the range of 2–8%, and He concentration was 80–90%. The gas pressure in the discharge tube used for sputtering varied between 1 and 10 Torr, and the current was between 10 and 50 mA. It was shown that the proposed method enables the extraction of information on the composition of the surface layer of the investigated film and the development of an on-line inspection, without extracting the film from the sputtering chamber. Full article
(This article belongs to the Special Issue The Composition and Photoelectrochemical Performance of Thin Films)
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12 pages, 4958 KiB  
Article
Surface Analysis of TMCTS-Based SiOC(H) Low-k Dielectrics in Post-Etch Strip of ACL Hardmask
by Min Kyu Park, Wan Soo Song, Min Ho Kim and Sang Jeen Hong
Materials 2021, 14(5), 1144; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14051144 - 28 Feb 2021
Viewed by 2246
Abstract
The miniaturization of devices requires the introduction of a high aspect ratio through patterning in the Damascene copper interconnect process. The high aspect ratio etch process employs hardmasks, such as amorphous carbon, that can withstand high-powered plasma exposure. When an etch hardmask is [...] Read more.
The miniaturization of devices requires the introduction of a high aspect ratio through patterning in the Damascene copper interconnect process. The high aspect ratio etch process employs hardmasks, such as amorphous carbon, that can withstand high-powered plasma exposure. When an etch hardmask is removed after patterning, the properties of the underlying film can be altered by the effect of plasma exposure during the strip process. In this study, surface properties of SiOC(H) are investigated after an amorphous carbon strip with O2/Ar plasma. Since the low-k film of SiOC(H) structure shows characteristics according to the Si-O internal bonding structure, the Si-O bonding ratio of the ring, network and cage structure was analyzed through Fourier-transform infrared (FT-IR) analysis to measure changes in thin film properties. X-ray photoelectron spectroscopy (XPS) was also used to add reliability to the SiOC(H) film structure. In addition, the end point of the strip process was obtained using an optical emission spectroscopy sensor and variations in thin film characteristics over the plasma exposure time were analyzed. These results revealed the structural modification of the SiCO(H) thin film in the post-etch strip of the amorphous carbon layer (ACL) hardmask. Full article
(This article belongs to the Special Issue The Composition and Photoelectrochemical Performance of Thin Films)
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