ICKEM2020 - Hierarchically Structured Materials (HSM)

Dear Colleagues,

The 10th International Conference on Key Engineering Materials (ICKEM 2020) (http://www.ickem.org/) will be held on 26–29 March 2020 in Madrid, Spain.

Previous ICKEM meetings were held every year since 2011 in Sanya (China), Singapore, Kota Kinabalu (Malaysia), Bali (Indonesia), Singapore, Hong Kong, Penang (Malaysia), Osaka (Japan) and Oxford (United Kingdom). With a history of successful ICKEM events over the past 9 years, we are confident that the 10th edition of ICKEM in 2020 will be an even greater success.

The purpose of the 10th International Conference on Key Engineering Materials is to bring together researchers, engineers, and practitioners interested in the wide range of fields related to the materials that underpin modern technologies. Papers presenting original work on the topics listed below are invited.

1. Biomaterials in different applications
2. Novel composite materials in vivid applications
3. Application of novel materials in civil engineering
4. Advances in materials and manufacturing technology
5. Materials and technologies in environmental engineering
6. Studies on corrosion, coatings, and aspects of chemical engineering
7. Electrical, electronic, and optoelectronic materials: synthesis and applications
8. Trends in the development of nanomaterials, nanocomposites and nanotechnology

For this edition of the ICKEM meeting, the conference chair, Professor Alexander M. Korsunsky from the University of Oxford, UK, proposed the topic of hierarchically-structured materials (HSM) as the focal theme.

Natural and engineered in widespread use in highly-demanding applications are characterized by multi-level hierarchical structuring from the atomic and molecular building blocks to material nano-volumes and continua, inherent properties are determined using the intricate composite architectures, which govern macroscopic properties and performance.

Various simulation frameworks have been put used model the material structure and behaviour at different length scales. Different techniques have also been developed for experimental testing, with appropriate sensitivity and resolution for each length scale involved. While this view of multi-scale material modelling and characterization is widely accepted and used, there are a number of conceptual, theoretical, and applied challenges that remain unresolved, e.g., rigorous definition of distinct structural scale, robust approach to the validation of multi-scale modelling frameworks, etc. In an attempt to advance our understanding in these areas, the special issue will focus on Hierarchically-Structured Materials (HSM) in which specific research results will be included and examined in the light of the framework outlined above. This volume will consist of contributions to this overarching theme from the worldwide materials engineering community.

Prof. Alexander Korsunsky
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• Biomaterials in different applications
• Novel composite materials in vivid applications
• Application of novel materials in civil engineering
• Advances in materials and manufacturing technology
• Materials and technologies in environmental engineering
• Studies on corrosion, coatings, and aspects of chemical engineering
• Electrical, electronic, and optoelectronic materials: synthesis and applications
• Trends in the development of nanomaterials, nanocomposites and nanotechnology.