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Simulation and Reliability Assessment of Advanced Packaging
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Simulation and Reliability Assessment of Advanced Packaging

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Simulation and Design".

Deadline for manuscript submissions: closed (20 February 2022) | Viewed by 42200

Special Issue Editor

Prof. Dr. Kuo-Ning Chiang

E-Mail Website
Guest Editor
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
Interests: design and reliability assessment of advanced electronic packaging; nanomechanics and nanostructure analysis; artificial intelligence algorithms; computational solid mechanics; AI-assisted design-on-simulation technology

Special Issue Information

Dear Colleagues,

Simulation-based technology plays an important role in the design, structure optimization, and evaluation of the reliability life of advanced packaging, which has become a design trend in the electronics packaging community. The purpose of this Special Issue is to introduce the latest research results of simulation-based technology in advanced packaging today, and the topics to be covered include material characterization of electronic packaging, theoretical or empirical work, modeling, simulation technology, design and validation, AI-assisted design-on-simulation technology, and reliability life prediction. Prospective authors are encouraged to contribute their original and unpublished works in the abovementioned areas.

It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, letters, and reviews are all welcome.

Prof. Dr. Kuo-Ning Chiang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • simulation
  • reliability assessment
  • electronic packaging
  • design
  • artificial intelligence
  • advanced packaging
  • wafer level packaging
  • stress/strain
  • thermal
  • electromigration

Published Papers (17 papers)

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Research

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16 pages, 4332 KiB  
Article
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks
by Cadmus Yuan, Qinghua Su and Kuo-Ning Chiang
Materials 2023, 16(14), 4922; https://0-doi-org.brum.beds.ac.uk/10.3390/ma16144922 - 10 Jul 2023
Cited by 3 | Viewed by 924
Abstract
Equation-Informed Neural Networks (EINNs) are developed as an efficient method for extracting the coefficients of constitutive equations. Subsequently, numerical Bayesian Inference (BI) iterations were applied to estimate the distribution of these coefficients, thereby further refining them. We could generate coefficients optimally aligned with [...] Read more.
Equation-Informed Neural Networks (EINNs) are developed as an efficient method for extracting the coefficients of constitutive equations. Subsequently, numerical Bayesian Inference (BI) iterations were applied to estimate the distribution of these coefficients, thereby further refining them. We could generate coefficients optimally aligned with the targeted application scenario by carefully adjusting pre-processing mapping parameters and identifying dataset preferences. Leveraging graphical representation techniques, the EINNs formulation is implemented in temperature- and strain-rate-dependent hyperbolic Garofalo, Anand, and Chaboche constitutive models to extract the corresponding coefficients for lead-free SAC305 solder material. The performance of the EINNs-based extracted coefficients, obtained from experimental results of SAC305 solder material, is comparable to existing studies. The methodology offers the dual advantage of providing the coefficients’ value and distribution against the training dataset. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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15 pages, 56760 KiB  
Article
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
by Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang and C. R. Kao
Materials 2022, 15(12), 4297; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15124297 - 17 Jun 2022
Cited by 2 | Viewed by 1713
Abstract
The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the intermetallic compounds (IMCs) with the adhesion layer may [...] Read more.
The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the intermetallic compounds (IMCs) with the adhesion layer may pose serious reliability concerns. In this study, the terminal reaction of the Ti adhesion layer with Cu–Sn IMCs was investigated by aging the micro-bumps at 200 °C. Although all of the micro-bumps transformed into intermetallic structures after aging, they exhibited a strong attachment to the Ti adhesion layer, which differs significantly from the Cr system where spalling of IMCs occurred during the solid-state reaction. Moreover, the difference in the diffusion rates between Cu and Sn might have induced void formation during aging. These voids progressed to the center of the bump through the depleting Cu layer. However, they neither affected the attachment between the IMCs and the adhesion layer nor reduced the strength of the bumps. In conclusion, the IMCs demonstrated better adhesive behavior with the Ti adhesion layer when compared to Cr, which has been used in previous studies. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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14 pages, 3305 KiB  
Article
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms
by Qing-Hua Su and Kuo-Ning Chiang
Materials 2022, 15(11), 3897; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15113897 - 30 May 2022
Cited by 10 | Viewed by 1857
Abstract
With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and footprint area of the package. An important issue [...] Read more.
With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and footprint area of the package. An important issue in the design of WLP is how to quickly and accurately predict the reliability life under the accelerated thermal cycling test (ATCT). If the simulation approach is not adopted, it usually takes several ACTCs to design a WLP, and each ACTC will take several months to get the reliability life results, which increases development time considerably. However, simulation results may differ depending on the designer’s domain knowledge, ability, and experience. This shortcoming can be overcome with artificial intelligence (AI). In this study, finite element analysis (FEA) is combined with machine learning algorithms, e.g., Kernel Ridge Regression (KRR), to create an AI model for predicting the reliability life of electronic packaging. Kernel Ridge Regression (KRR) combined with the K-means cluster algorithm provides a highly accurate and efficient way to obtain AI models for large-scale data sets. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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22 pages, 18695 KiB  
Article
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al-Bakri Abdullah, Nur Izzati Muhammad Nadzri, Andrei Victor Sandu, Petrica Vizureanu, Mohd Izrul Izwan Ramli, Kazuhiro Nogita, Hideyuki Yasuda and Ioan Gabriel Sandu
Materials 2022, 15(8), 2758; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15082758 - 08 Apr 2022
Cited by 3 | Viewed by 1912
Abstract
Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% [...] Read more.
Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% kaolin geopolymer ceramics (KGC). The samples were fabricated using powder metallurgy with the hybrid microwave sintering method. Apart from using conventional cross-sectioned microstructure imaging, advanced synchrotron real-time in situ imaging was used to observe primary IMC formation in SAC305-KGC solder joints subjected to multiple reflow soldering. The addition of KGC particles in SAC305 suppressed the Cu6Sn5 IMC’s growth as primary and interfacial layers, improving the shear strength after multiple reflow soldering. The growth rate constant for the interfacial Cu6Sn5 IMC was also calculated in this study. The average growth rate of the primary Cu6Sn5 IMCs decreased from 49 µm/s in SAC305 to 38 µm/s with the addition of KGC particles. As a result, the average solidified length in the SAC305-KGC is shorter than SAC305 for multiple reflow soldering. It was also observed that with KGC additions, the growth direction of the primary Cu6Sn5 IMC in SAC305 changed from one growth to two growth directions. The observed results can be attributed to the presence of KGC particles both at grains of interfacial Cu6Sn5 IMCs and at the surface of primary Cu6Sn5 IMC. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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23 pages, 17245 KiB  
Article
Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices
by Chin-Hao Tsai, Wei-Chen Huang and Chengheng Robert Kao
Materials 2022, 15(4), 1397; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15041397 - 14 Feb 2022
Cited by 7 | Viewed by 1666
Abstract
Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attachment joints. In [...] Read more.
Sintered silver paste is widely used as the die-attachment material for power semiconductors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attachment joints. In this paper, a novel method of sintering silver joints is demonstrated, where silver–indium alloy paste is used to improve the reliability of sintered Ag joints. The silver–indium (Ag–In) alloy paste was fabricated through mechanical alloying using the ball-milling technique. The well-bonded sintered Ag–In alloy joints inhibited pore coarsening better than pure sintered Ag joints and significantly enhanced the mechanical properties at high operating temperatures. Lastly, an oxidation mechanism for the sintered joint was proposed, and strategies to prevent such high-temperature oxidation were discussed. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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16 pages, 3677 KiB  
Article
Study on the Strip Warpage Issues Encountered in the Flip-Chip Process
by Wan-Chun Chuang and Wei-Long Chen
Materials 2022, 15(1), 323; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15010323 - 03 Jan 2022
Cited by 6 | Viewed by 4033
Abstract
This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be [...] Read more.
This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be less than 8%. Taguchi analysis was employed to identify the key factors affecting strip warpage, which were discovered to be die thickness and substrate thickness, followed by mold compound thickness and molding temperature. Although a greater die thickness and mold compound thickness reduce the strip warpage, they also substantially increase the overall strip thickness. To overcome this problem, design criteria are proposed, with the neutral axis of the strip structure located on the bump. The results obtained using the criteria revealed that the strip warpage and overall strip thickness are effectively reduced. In summary, the proposed model can be used to evaluate the effect of structural design and process parameters on strip warpage and can provide strip design guidelines for reducing the amount of strip warpage and meeting the requirements for light, thin, and short chips on the production line. In addition, the proposed guidelines can accelerate the product development cycle and improve product quality with reduced development costs. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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12 pages, 2871 KiB  
Article
The Effect of the Crucible on the Temperature Distribution for the Growth of a Large Size AlN Single Crystal
by Yue Yu, Botao Liu, Xia Tang, Botao Song, Pengfei Han, Sheng Liu and Bing Gao
Materials 2022, 15(1), 54; https://0-doi-org.brum.beds.ac.uk/10.3390/ma15010054 - 22 Dec 2021
Cited by 2 | Viewed by 2686
Abstract
The appropriate distribution of temperature in the growth system is critical for obtaining a large size high quality aluminum nitride (AlN) single crystal by the physical vapor transport (PVT) method. As the crystal size increases, the influence of the crucible on the temperature [...] Read more.
The appropriate distribution of temperature in the growth system is critical for obtaining a large size high quality aluminum nitride (AlN) single crystal by the physical vapor transport (PVT) method. As the crystal size increases, the influence of the crucible on the temperature distribution inside the growth chamber becomes greater. In order to optimize the field of temperature and study the specific effects of various parts of the crucible on the large size AlN single crystal growth system, this study carried out a series of numerical simulations of the temperature field of two crucibles of different materials and put forward the concept of a composite crucible, which combines different materials in the crucible parts. Four composite crucible models were established with different proportions and positions of tantalum carbide (TaC) parts and graphite parts in the crucible. Calculations reveal that different parts of the crucible have different effects on the internal temperature distribution. The axial temperature gradient at the crystal was mainly governed by the crucible wall, whereas the temperature gradient was determined by the integrated effect of the crucible lid and the crucible wall in the radial direction. One type of composite crucible was chosen to minimize the thermal stress in grown AlN crystal, which is applicable to the growth of large sized AlN crystals in the future; it can also be used to grow AlN single crystals at present as well. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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14 pages, 4719 KiB  
Article
Exploring Dielectric Constant and Dissipation Factor of LTCC Using Machine Learning
by Yu-chen Liu, Tzu-Yu Liu, Tien-Heng Huang, Kuo-Chuang Chiu and Shih-kang Lin
Materials 2021, 14(19), 5784; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14195784 - 03 Oct 2021
Cited by 7 | Viewed by 1981
Abstract
Low-temperature co-fired ceramics (LTCCs) have been attracting attention due to rapid advances in wireless telecommunications. Low-dielectric-constant (Dk) and low-dissipation-factor (Df) LTCCs enable a low propagation delay and high signal quality. However, the wide ranges of glass, ceramic filler compositions, [...] Read more.
Low-temperature co-fired ceramics (LTCCs) have been attracting attention due to rapid advances in wireless telecommunications. Low-dielectric-constant (Dk) and low-dissipation-factor (Df) LTCCs enable a low propagation delay and high signal quality. However, the wide ranges of glass, ceramic filler compositions, and processing features in fabricating LTCC make property modulating difficult via experimental trial-and-error approaches. In this study, we explored Dk and Df values of LTCCs using a machine learning method with a Gaussian kernel ridge regression model. A principal component analysis and k-means methods were initially performed to visually analyze data clustering and to reduce the dimension complexity. Model assessments, by using a five-fold cross-validation, residual analysis, and randomized test, suggest that the proposed Dk and Df models had some predictive ability, that the model selection was appropriate, and that the fittings were not just numerical due to a rather small data set. A cross-plot analysis and property contour plot were performed for the purpose of exploring potential LTCCs for real applications with Dk and Df values less than 10 and 2 × 10−3, respectively, at an operating frequency of 1 GHz. The proposed machine learning models can potentially be utilized to accelerate the design of technology-related LTCC systems. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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11 pages, 5922 KiB  
Article
Investigation of Adhesive’s Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test
by Mei-Ling Wu and Jia-Shen Lan
Materials 2021, 14(19), 5626; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14195626 - 27 Sep 2021
Viewed by 2411
Abstract
A hermetic Micro-Electro-Mechanical Systems (MEMS) package with a metal lid is investigated to prevent lid-off failure and improve its reliability during the precondition test. While the MEMS package benefits from miniaturization and low cost, a hermetic version is highly sensitive to internal pressure [...] Read more.
A hermetic Micro-Electro-Mechanical Systems (MEMS) package with a metal lid is investigated to prevent lid-off failure and improve its reliability during the precondition test. While the MEMS package benefits from miniaturization and low cost, a hermetic version is highly sensitive to internal pressure caused by moisture penetration and the reflow process, thus affecting its reliability. In this research, the finite element method is applied to analyze the contact stress between the metal lid and the silver epoxy by applying the cohesive zone model (CZM). Moreover, the red dye penetration test is applied, revealing a microcrack at the metal lid/silver epoxy interface. Further analyses indicate that the crack is caused by internal pressure. According to the experimental testing and simulation results, the silver epoxy material, the curing process, the metal lid geometry, and the bonding layer contact area can enhance the bonding strength between the metal lid and the substrate. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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18 pages, 5723 KiB  
Article
Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles
by Hsien-Chie Cheng, Siang-Yu Lin and Yan-Cheng Liu
Materials 2021, 14(18), 5427; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14185427 - 19 Sep 2021
Cited by 5 | Viewed by 2320
Abstract
This study introduces an effective and efficient dynamic electro-thermal coupling analysis (ETCA) approach to explore the electro-thermal behavior of a three-phase power metal–oxide–semiconductor field-effect transistor (MOSFET) inverter for brushless direct current motor drive under natural and forced convection during a six-step operation. This [...] Read more.
This study introduces an effective and efficient dynamic electro-thermal coupling analysis (ETCA) approach to explore the electro-thermal behavior of a three-phase power metal–oxide–semiconductor field-effect transistor (MOSFET) inverter for brushless direct current motor drive under natural and forced convection during a six-step operation. This coupling analysis integrates three-dimensional electromagnetic simulation for parasitic parameter extraction, simplified equivalent circuit simulation for power loss calculation, and a compact Foster thermal network model for junction temperature prediction, constructed through parametric transient computational fluid dynamics (CFD) thermal analysis. In the proposed ETCA approach, the interactions between the junction temperature and the power losses (conduction and switching losses) and between the parasitics and the switching transients and power losses are all accounted for. The proposed Foster thermal network model and ETCA approach are validated with the CFD thermal analysis and the standard ETCA approach, respectively. The analysis results demonstrate how the proposed models can be used as an effective and efficient means of analysis to characterize the system-level electro-thermal performance of a three-phase bridge inverter. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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17 pages, 4736 KiB  
Article
Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique
by Pei-Chen Huang and Chang-Chun Lee
Materials 2021, 14(18), 5226; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14185226 - 11 Sep 2021
Cited by 2 | Viewed by 1813
Abstract
Stress-induced performance change in electron packaging architecture is a major concern when the keep-out zone (KOZ) and corresponding integration density of interconnect systems and transistor devices are considered. In this study, a finite element analysis (FEA)-based submodeling approach is demonstrated to analyze the [...] Read more.
Stress-induced performance change in electron packaging architecture is a major concern when the keep-out zone (KOZ) and corresponding integration density of interconnect systems and transistor devices are considered. In this study, a finite element analysis (FEA)-based submodeling approach is demonstrated to analyze the stress-affected zone of through-silicon via (TSV) and its influences on a planar metal oxide semiconductor field transistor (MOSFET) device. The feasibility of the widely adopted analytical solution for TSV stress-affected zone estimation, Lamé radial stress solution, is investigated and compared with the FEA-based submodeling approach. Analytic results reveal that the Lamé stress solution overestimates the TSV-induced stress in the concerned device by over 50%, and the difference in the estimated results of device performance between Lamé stress solution and FEA simulation can reach 22%. Moreover, a silicon–germanium-based lattice mismatch stressor is designed in a silicon p-type MOSFET, and its effects are analyzed and compared with those of TSV residual stress. The S/D stressor dominates the stress status of the device channel. The demonstrated FEA-based submodeling approach is effective in analyzing the stress impact from packaging and device-level components and estimating the KOZ issue in advanced electronic packaging. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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19 pages, 7279 KiB  
Article
Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models
by Cadmus Yuan, Xuejun Fan and Gouqi Zhang
Materials 2021, 14(17), 4835; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14174835 - 26 Aug 2021
Cited by 13 | Viewed by 2147
Abstract
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the [...] Read more.
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process parameters. Due to the time-dependent and nonlinear characteristics of the solder joint fatigue failure, this research follows the AI-assisted simulation framework and builds the non-sequential artificial neural network (ANN) and sequential recurrent neural network (RNN) architectures. Both are investigated to understand their capability of abstracting the time-dependent solder joint fatigue knowledge from the dataset. Moreover, this research applies the genetic algorithm (GA) optimization to decrease the influence of the initial guessings, including the weightings and bias of the neural network architectures. In this research, two GA optimizers are developed, including the “back-to-original” and “progressing” ones. Moreover, we apply the principal component analysis (PCA) to the GA optimization results to obtain the PCA gene. The prediction error of all neural network models is within 0.15% under GA optimized PCA gene. There is no clear statistical evidence that RNN is better than ANN in the wafer level chip-scaled packaging (WLCSP) solder joint reliability risk estimation when the GA optimizer is applied to minimize the impact of the initial AI model. Hence, a stable optimization with a broad design domain can be realized by an ANN model with a faster training speed than RNN, even though solder fatigue is a time-dependent mechanical behavior. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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17 pages, 6541 KiB  
Article
Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication
by Hsien-Chie Cheng, Ling-Ching Tai and Yan-Cheng Liu
Materials 2021, 14(17), 4816; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14174816 - 25 Aug 2021
Cited by 13 | Viewed by 4077
Abstract
This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is introduced for effectively predicting [...] Read more.
This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is introduced for effectively predicting the process-induced warpage. The mechanical FEA takes into account the viscoelastic behavior and cure shrinkage of the epoxy molding compound. In order to enhance the computational and modeling efficiency and retain the prediction accuracy at the same time, this study proposes a novel effective approach that combines the trace mapping method, rule of mixture and FEA to estimate the effective orthotropic elastic properties of the coreless substrate and core interposer. The study begins with experimental measurement of the temperature-dependent elastic and viscoelastic properties of the components in the assembly, followed by the prediction of the effective elastic properties of the orthotropic interposer and substrate. The predicted effective results are compared against the results of the ROM/analytical estimate and the FEA-based effective approach. Moreover, the warpages obtained from the proposed process simulation framework are validated by the in-line measurement data, and good agreement is presented. Finally, key factors that may influence process-induced warpage are examined via parametric analysis. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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16 pages, 8679 KiB  
Article
Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables
by Yu-Hsiang Yang, Hsiu-Ping Wei, Bongtae Han and Chao Hu
Materials 2021, 14(16), 4619; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14164619 - 17 Aug 2021
Viewed by 1566
Abstract
A metamodeling technique based on Bivariate Cut High Dimensional Model Representation (Bivariate Cut HDMR) is implemented for a semiconductor packaging design problem with 10 design variables. Bivariate Cut-HDMR constructs a metamodel by considering only up to second-order interactions. The implementation uses three uniformly [...] Read more.
A metamodeling technique based on Bivariate Cut High Dimensional Model Representation (Bivariate Cut HDMR) is implemented for a semiconductor packaging design problem with 10 design variables. Bivariate Cut-HDMR constructs a metamodel by considering only up to second-order interactions. The implementation uses three uniformly distributed sample points (s = 3) with quadratic spline interpolation to construct the component functions of Bivariate Cut-HDMR, which can be used to make a direct comparison with a metamodel based on Central Composite Design (CCD). The performance of Bivariate Cut-HDMR is evaluated by two well-known error metrics: R-squared and Relative Average Absolute Error (RAAE). The results are compared with the performance of CCD. Bivariate Cut HDMR does not compromise the accuracy compared to CCD, although the former uses only one-fifth of sample points (201 sample points) required by the latter (1045 sample points). The sampling schemes and the predictions of cut-planes and boundary-planes are discussed to explain possible reasons for the outstanding performance of Bivariate Cut HDMR. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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13 pages, 2054 KiB  
Article
Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener
by Chih-Ming Chen, Huey-Ling Chang and Chun-Ying Lee
Materials 2021, 14(15), 4193; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14154193 - 27 Jul 2021
Cited by 3 | Viewed by 1753
Abstract
Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications. [...] Read more.
Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications. This study investigates the possible use of 2-hydroxyethyl methacrylate (HEMA) toughening agent and nano-powders, such as alumina, silicon dioxide, and carbon black, to form epoxy composites for dynamic property improvement. Considering the different combinations of the nano-powders and HEMA toughener, the Taguchi method with an L9 orthogonal array was adopted for composition optimization. The dynamic storage modulus and loss tangent of the prepared specimen were measured by employing a dynamic mechanical analyzer. With polynomial regression, the curve-fitted relationships of the glass transition temperature and storage modulus with respect to the design factors were obtained. It was found that although the raise in the weight fraction of nano-powders was beneficial in increasing the rigidity of the epoxy composite, an optimal amount of HEMA toughener existed for its best damping improvement. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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18 pages, 6817 KiB  
Article
Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
by Ming-Yi Tsai, Yu-Wen Wang and Chia-Ming Liu
Materials 2021, 14(13), 3723; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14133723 - 02 Jul 2021
Cited by 11 | Viewed by 3207
Abstract
The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated with a beam model [...] Read more.
The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated with a beam model theory to determine the thermally induced deformations and warpages of both packages. First, validation and limitations of the beam model theory are presented. Then, the thermally induced out-of-plane deformations for both packages are well described by the finite element method (FEM) simulation with a good consistency to full-field shadow moiré experimental results. The strain gauge measurements were implemented experimentally, and the thermal strain results were found to be well consistent with validated FEM ones. As a result, out-of-plane thermal deformations and warpages of the packages, calculated from the beam model theory with extracted curvature data from the strain gauge, were in reasonably good agreement with those from FEM analysis and shadow moiré measurements. Therefore, the strain gauge method of featuring point strain measurement combined with the beam model theory proved feasible in determining the thermal deformations and warpages of both IC packages. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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Review
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
by Sunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai and Kuo-Ning Chiang
Materials 2021, 14(18), 5342; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14185342 - 16 Sep 2021
Cited by 20 | Viewed by 4251
Abstract
Several design parameters affect the reliability of wafer-level type advanced packaging, such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip thickness, etc. Conventionally, the accelerated thermal cycling test (ATCT) is used to evaluate the reliability life of electronic [...] Read more.
Several design parameters affect the reliability of wafer-level type advanced packaging, such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip thickness, etc. Conventionally, the accelerated thermal cycling test (ATCT) is used to evaluate the reliability life of electronic packaging; however, optimizing the design parameters through ATCT is time-consuming and expensive, reducing the number of experiments becomes a critical issue. In recent years, many researchers have adopted the finite-element-based design-on-simulation (DoS) technology for the reliability assessment of electronic packaging. DoS technology can effectively shorten the design cycle, reduce costs, and effectively optimize the packaging structure. However, the simulation analysis results are highly dependent on the individual researcher and are usually inconsistent between them. Artificial intelligence (AI) can help researchers avoid the shortcomings of the human factor. This study demonstrates AI-assisted DoS technology by combining artificial intelligence and simulation technologies to predict wafer level package (WLP) reliability. In order to ensure reliability prediction accuracy, the simulation procedure was validated by several experiments prior to creating a large AI training database. This research studies several machine learning models, including artificial neural network (ANN), recurrent neural network (RNN), support vector regression (SVR), kernel ridge regression (KRR), K-nearest neighbor (KNN), and random forest (RF). These models are evaluated in this study based on prediction accuracy and CPU time consumption. Full article
(This article belongs to the Special Issue Simulation and Reliability Assessment of Advanced Packaging)
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