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Engineering Applications of Thermoelectric Materials and Devices

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Mechanics of Materials".

Deadline for manuscript submissions: closed (10 September 2022) | Viewed by 281

Special Issue Editor


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Guest Editor
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China
Interests: micro-mechanics of thermoelectric materials

Special Issue Information

Dear Colleagues,

During the last two decades, we have witnessed a great breakthrough in improving the zT values of thermoelectric (TE) materials. However, thermoelectric materials and devices have not yet seen industrial applications. In working conditions, TE devices may suffer from thermal-cycling stresses, leading to the degradation of TE materials and their mechanical properties, resulting in device failure. The engineering applications of TE materials and devices inspire us to elucidate many significant scientific issues, such as the mechanical properties of TE materials, the performance stability of TE materials and devices, the interface stability of TE materials/joint metals, the fracture and fatigue processes for TE materials, their damage mechanisms, etc.

This Special Issue focuses on the above topics regarding the “Engineering Applications of Thermoelectric Materials and Devices”. Authors are welcome to publish their research on all the above topics to promote the industrial application of thermoelectric materials and devices.

Prof. Dr. Guodong Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermoelectric materials and devices
  • engineering applications
  • mechanical properties

Published Papers

There is no accepted submissions to this special issue at this moment.
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