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Advance in Low-Noise, Low-Power Integrated Smart Sensors

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".

Deadline for manuscript submissions: closed (31 January 2022) | Viewed by 249

Special Issue Editors

University of Pisa, Dipartimento di Ingegneria dell’Informazione, via Caruso 16, I-56122 Pisa, Italy
Interests: analog-integrated circuits; mixed signal integrated circuits; integrated sensors; sensor interfaces; MEMS; thermal sensors; low-power analog circuits; low-noise analog circuits
Special Issues, Collections and Topics in MDPI journals
Dipartimento di Ingegneria dell’Informazione, University of Pisa, via Caruso 16, I-56122 Pisa, Italy
Interests: analog-integrated circuits; mixed signal integrated circuits; sensor interfaces; analog-to-digital converters, low-power analog circuits; ultra-low-voltage analog circuits
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In the last few years, sensors have become increasingly more pervasive in a large number of key areas, such as smart industries, smart cities, health and environmental monitoring, terrestrial and aerial transportation and robotics. New applications have multiplied the request for sensors but, at the same time, have introduced new paradigms that cannot be satisfied by traditional sensing components. Extreme miniaturization, ridiculously small power consumption, unprecedented resolution and selectivity are common specifications for the next generation of sensors. To meet these requirements, sensors must be “smart”, i.e., they need to exploit new material properties, new architectures and sensing principles, and be paired with dedicated low-noise–low-power electronic interfaces that should be preferably packed on the same chip or in the same housing as the sensing elements.

This Special Issue is meant to collect research or review papers focused on innovative smart sensors, with particular emphasis on new material properties, new sensing structures, original sensing principle, and a successful combination of physical or chemical sensing devices with effective readout interfaces. The goal is to provide a deep insight into new and future advances in the field of smart sensors, giving particular priority to proven or envisioned improvements in terms of size, power consumption, resolution and accuracy.

Prof. Dr. Paolo Bruschi
Dr. Alessandro Catania
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • materials for sensor
  • sensor architectures
  • chemical sensors
  • physical sensors
  • MEMS and MOEMS
  • detection noise
  • sensor readout interfaces

Published Papers

There is no accepted submissions to this special issue at this moment.
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