This is the fourth part of a study presenting a miniature, combustion-type gas sensor (dubbed GMOS) based on a novel thermal sensor (dubbed TMOS). The TMOS is a micromachined CMOS-SOI transistor, which acts as the sensing element and is integrated with a catalytic reaction plate, where ignition of the gas takes place. The GMOS measures the temperature change due to a combustion exothermic reaction. The controlling parameters of the sensor are the ignition temperature applied to the catalytic layer and the increased temperature of the hotplate due to the released power of the combustion reaction. The solid-state device applies electrical parameters, which are related to the thermal parameters. The heating is applied by Joule heating with a resistor underneath the catalytic layer while the signal is monitored by the change in voltage of the TMOS sensor. Voltage, like temperature, is an intensive parameter, and one always measures changes in such parameters relative to a reference point. The reference point for both parameters (temperature and voltage) is the blind sensor, without any catalytic layer and hence where no reaction takes place. The present paper focuses on the study of the effect of humidity upon performance. In real life, the sensors are exposed to environmental parameters, where humidity plays a significant role. Humidity is high in storage rooms of fruits and vegetables, in refrigerators, in silos, in fields as well as in homes and cars. This study is significant and innovative since it extends our understanding of the performance of the GMOS, as well as pellistor sensors in general, in the presence of humidity. The three main challenges in simulating the performance are (i) how to define the operating temperature based on the input parameters of the heater voltage in the presence of humidity; (ii) how to measure the dynamics of the temperature increase during cyclic operation at a given duty cycle; and (iii) how to model the correlation between the operating temperature and the sensing response in the presence of humidity. Due to the complexity of the 3D analysis of packaged GMOS, and the many aspects of humidity simultanoesuly affecting performane, advanced simulation software is applied, incorporating computational fluid dynamics (CFD). The simulation and experimental data of this study show that the GMOS sensor can operate in the presence of high humidity. Full article

A monolithic pixel sensor with high spatial granularity (35 × 40 μm²) is presented, aiming at thermal neutron detection and imaging. The device is made using the CMOS SOIPIX technology, with Deep Reactive-Ion Etching post-processing on the backside to obtain high aspect-ratio cavities that will be filled with neutron converters. This is the first monolithic 3D sensor ever reported. Owing to the microstructured backside, a neutron detection efficiency up to 30% can be achieved with a ¹⁰B converter, as estimated by the Geant4 simulations. Each pixel includes circuitry that allows a large dynamic range and energy discrimination and charge-sharing information between neighboring pixels, with a power dissipation of 10 µW per pixel at 1.8 V power supply. The initial results from the experimental characterization of a first test-chip prototype (array of 25 × 25 pixels) in the laboratory are also reported, dealing with functional tests using alpha particles with energy compatible with the reaction products of neutrons with the converter materials, which validate the device design. Full article

The need to achieve digital gas sensing technology, namely, a technology to sense and transmit gas-enabled digital media, has been recognized as highly challenging. This challenge has motivated the authors to focus on complementary metal oxide semiconductor silicon on insulator micro electro-mechanical system (CMOS-SOI-MEMS) technologies, and the result is a new pellistor-like sensor, dubbed GMOS, with integrated signal processing. In this study, we describe the performance of such sensors for the selective detection of mixtures of gases. The novel key ideas of this study are: (i) the use of the GMOS for gas sensing; (ii) applying the Kalman filter to improve the signal-to-noise ratio; (iii) adding artificial intelligence (AI) with tiny edge approach. Full article

Microbolometers based on the CMOS process has the important advantage of being automatically merged with circuits in the fabrication of larger arrays, but they typically suffer from low detectivity due to the difficulty in realizing high-sensitivity thermistors in the CMOS process. In this paper, two resistive microbolometers based on polysilicon and metal Al thermistors, respectively, are designed and fabricated by the standard CMOS process. Experimental results show that the detectivity of the two resistive microbolometers can reach a maximum of 1.78 × 10⁹ cmHz^1/2/W at 25 μA and a maximum of 6.2 × 10⁸ cmHz^1/2/W at 267 μA. The polysilicon microbolometer exhibits better detectivity at lower bias current due to its lower effective thermal conductivity and larger resistance. Even though the thermal time constant of the polysilicon thermistor is three times slower than that of the metal Al thermistor, the former is more suitable for designing a thermal imaging system with sensitive and low power consumption. Full article

In this study, we designed a microelectromechanical system (MEMS) Pirani vacuum sensor with a compact size. Specifically, the sensor was successfully fabricated based on the Pirani principle and using a commercial eight-inch MEMS foundry process. The sensor fabrication process was carried out using only four photomasks and the proposed sensor had an ultra-compact fabricated size (<2.2 × 2.2 mm²). A vacuum measurement system was set up to comprehensively evaluate the fabricated sensors. The results demonstrated that the MEMS Pirani vacuum sensor has a high responsivity in the low-pressure domain from 100 Pa. The proposed sensor with a 953.0-Ω heater exhibited an average responsivity of 11.9 mV/Pa in the preferred range of 100 to 7 Pa and 96.0 mV/Pa in the range of 7 to 1 Pa. The sensor may be potentially suitable in many applications, such as vacuum indicators for processing equipment, health monitoring systems for social infrastructure, and medical and health applications. Full article

To investigate the relationship between the specifications degradation of a low-noise amplifier (LNA) and temperature, we experimentally investigated the degradation characteristics of the specifications of the LNA at different temperatures. The small-signal gain (S21) of the LNA decreases with increasing temperature. This paper discusses and analyzes the experimental results in detail, and the reasons for the degradation of LNA specifications with temperature changes are known. Finally, we have tried to use the structure already available in the literature for the PA temperature compensation circuit for the temperature compensation of the LNA. The results show that the existing circuit structure for PA temperature compensation in the literature can also effectively compensate for the S21 and NF degradation of the LNA due to the temperature increase. Full article

This study develops a TEMH (thermoelectric energy micro harvester) chip utilizing a commercial 0.18 μm CMOS (complementary metal oxide semiconductor) process. The chip contains a TEMH and temperature sensors. The TEMH is established using a series of 54 thermocouples. The use of the temperature sensors monitors the temperature of the thermocouples. One temperature sensor is set near the cold part of the thermocouples, and the other is set near the hot part of the thermocouples. The performance of the TEMH relies on the TD (temperature difference) at the CHP (cold and hot parts) of the thermocouples. The more the TD at the CHP of the thermocouples increases, the higher the output voltage and output power of the TEMH become. To obtain a higher TD, the cold part of the thermocouples is designed as a suspended structure and is combined with cooling sheets to increase heat dissipation. The cooling sheet is constructed of a stack of aluminum layers and is mounted above the cold part of the thermocouple. A finite element method software, ANSYS, is utilized to compute the temperature distribution of the TEMH. The TEMH requires a post-process to obtain the suspended thermocouple structure. The post-process utilizes an RIE (reactive ion etch) to etch the two sacrificial materials, which are silicon dioxide and silicon substrate. The results reveal that the structure of the thermocouples is completely suspended and does not show any injury. The measured results reveal that the output voltage of the TEMH is 32.5 mV when the TD between the CHP of the thermocouples is 4 K. The TEMH has a voltage factor of 8.93 mV/mm²K. When the TD between the CHP of the thermocouples is 4 K, the maximum output power of the TEMH is 4.67 nW. The TEMH has a power factor of 0.31 nW/mm²K². Full article

High aspect ratio (HAR) through-silicon vias (TSVs) are in urgent need to achieve smaller keep-out zones (KOZs) and higher integration density for the miniaturization of high-performance three-dimensional (3D) integration of integrated circuits (IC), micro-electro-mechanical systems (MEMS), and other devices. In this study, HAR TSVs with a diameter of 11 μm and an aspect ratio of 10:1 are successfully fabricated in a low-cost process flow. Conformal polyimide (PI) liners are deposited using a vacuum-assisted spin coating technique, and the effects of spin coating time and speed on the deposition results are discussed. Then, continuous Cu seed layers are fabricated by sequential sputtering and ultrasound-assisted electroless plating. Additionally, void-free and seamless Cu conductors are formed by electroplating. Moreover, a semi-additive method is used to fabricate the redistribution layers (RDLs) on the insulating layers of photosensitive PI (PSPI). Notably, a plasma bombardment process is introduced to remove residual PSPI in the contact windows between RDLs and central pillars. Results show that the resistance of a single TSV from a daisy chain of 144 TSVs with density of 2000/mm² is about 28 mΩ. Additionally, the S-parameters of a single TSV are obtained using L-2L de-embedding technology, and the experimental and simulated results agree well. The proposed low-cost fabrication technologies and the related electrical characterization of PI-TSVs are significant for the application of HAR TSVs in modern heterogeneous integration systems. Full article

Power amplifier (PA) specifications are closely related to changes in temperature; thus, the small-signal gain (S21) of PA decreases with the temperature increase. To compensate for the degradation caused by the decrease in S21, we present a compensation circuit that consists of two diodes and four resistors. At the same time, a differential stacked millimeter-wave wideband PA was designed and implemented based on this compensation circuit and 55 nm CMOS process. The post-layout simulation results showed that the fluctuation of S21 reduced from 2.4 dB to 0.1 dB in the frequency range of 25−40 GHz over the temperature range of −40 °C to 125 °C. Furthermore, the proposed on-chip temperature compensation circuit also applies to multi-stage cascaded microwave/mm-wave power amplifiers. Full article

To investigate the critical specifications of a power amplifier (PA) under rapidly changing temperature conditions, we fabricated and tested a 0.3–1.1 GHz complementary metal–oxide–semiconductor (CMOS) PA under thermal shock tests. The results show that high- and low-temperature shocks can accelerate the degradation of critical specifications of PAs and that the critical specifications of PAs degrade with the increasing number of shocks. The main reason for the degradation of critical specifications of PAs with increasing thermal shock tests is the mismatch of thermal expansion coefficients of printed circuit boards (PCB) with FR-4 as a substrate. The results of this paper can provide a reference for the development of temperature-robust PAs design guidelines for the implementation of temperature-robust PAs using low-cost silicon technology. Full article