Small Scale Deformation using Advanced Nanoindentation Techniques, Volume III

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (28 February 2022) | Viewed by 2363

Special Issue Editors

Department of Chemical Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON N2L 3G1, Canada
Interests: nanoindentation; sub-micron fabrication; nanomechanics; thin film delaminations; integrate circuits; cell immobilization; morphology control of cells
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Guest Editor
Department of Mechanical Engineering, University of South Florida, 4202 E Fowler Ave. ENB 118, Tampa, FL 33620, USA
Interests: thin films processing; mechanical properties and characterization; adhesion and fracture of thin films; nanoindentation; pattern formation; irradiated materials properties; X-Ray diffraction
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Small-scale mechanical deformations have gained a significant interest over the past few decades, driven by the advances in integrated circuits and microelectromechanical systems. One of the most powerful and versatile characterization methods is the nanoindentation technique. The capabilities of these depth-sensing instruments have been improved considerably. They can perform experiments in vacuum and at high temperatures, such as in situ SEM and TEM nanoindenters. This allows researchers to visualize mechanical deformation and dislocation motion in real time. The time-dependent behavior of soft materials has also been studied in recent research works. This Special Issue on “Small Scale Deformation using Advanced Nanoindentation Techniques“ will provide a forum for researchers from the academic and industrial communities to present advances in the field of small-scale contact mechanics. Materials of interest include metals, glass, and ceramics. Manuscripts related to deformations of biomaterials and biological-related specimens are also welcome. Topics of interest include but are not limited to:

  • Small-scale facture;
  • Nanoscale plasticity and creep;
  • Size-dependent deformation phenomena;
  • Deformation of biological cells;
  • Mechanical properties of cellular and sub-cellular components;
  • Novel mechanical properties characterization techniques;
  • New modeling methods;
  • Environmentally-controlled nanoindentation;
  • In situ SEM and TEM indentation.

Prof. Dr. Ting Tsui
Prof. Dr. Alex A. Volinsky
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Nanoindentation
  • Small-scale mechanical properties
  • Deformation
  • Cells
  • Plasticity
  • Fracture
  • Contact mechanics

Published Papers (2 papers)

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Research

13 pages, 3099 KiB  
Article
Temperature-Induced Internal Stress Influence on Specimens in Indentation Tests
by Shunbo Wang, Xianke Li and Hongwei Zhao
Micromachines 2022, 13(7), 1045; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13071045 - 30 Jun 2022
Viewed by 1048
Abstract
The factors affecting the internal stress of specimens during indentation tests were investigated by finite element analysis (FEA) modelling. This was carried out to gain a qualitative understanding of the test errors introduced by the temperature environment during the indentation process. In this [...] Read more.
The factors affecting the internal stress of specimens during indentation tests were investigated by finite element analysis (FEA) modelling. This was carried out to gain a qualitative understanding of the test errors introduced by the temperature environment during the indentation process. In this study, the influence of thermal expansion of fixed stage on upper specimen (currently neglected in temperature indentation) was explored in detail. Technical issues associated with the parameters of the specimen (such as thickness, width, and elastic modulus) and external conditions (such as stage and glue) were identified and addressed. The test error of the calculated hardness and elastic modulus of the specimen reached up to more than 3% simultaneously at −196 °C (temperature of liquid nitrogen). Based on these considerations, the preferred operation conditions were identified for testing in specific temperature environment. These results can guide experiments aimed at obtaining precise mechanical parameters. Full article
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13 pages, 7784 KiB  
Article
Investigations of Micro-Deformation in Monocrystalline Copper at Low Temperatures via Indentation
by Shunbo Wang, Dan Zhao, Yihan Niu, Zhaoxin Wang, Hongxiu Yang and Hongwei Zhao
Micromachines 2022, 13(7), 1043; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13071043 - 30 Jun 2022
Cited by 2 | Viewed by 931
Abstract
Indentation experiments on differently oriented faces of monocrystalline copper were conducted to investigate the micro-deformation process at temperatures ranging from room temperature to 150 K. The morphologies and textures of the residual imprints were observed using electron microscopy. Distinct slip bands were observed [...] Read more.
Indentation experiments on differently oriented faces of monocrystalline copper were conducted to investigate the micro-deformation process at temperatures ranging from room temperature to 150 K. The morphologies and textures of the residual imprints were observed using electron microscopy. Distinct slip bands were observed inside the imprints at 150 K compared to smooth surfaces at room temperature. Molecular dynamics simulations were performed to identify the deformation process beneath the indentation region. The results showed that plastic deformation was inhibited with decreasing temperature, but elastic recovery during the unloading process was enhanced, resulting in inner slip bands (ISBs) being observable in the residual imprints. The performances of these ISBs were strongly associated with the angles between the indentation direction and major slip surfaces and could be considered microscopic forms on the surfaces of aggregated geometrically necessary dislocations (GNDs). This work helped reveal the micro-deformation mechanism of indentations inside imprints. Full article
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