Flexible Conductive Electronics: Materials, Methods, Fabrication and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: closed (31 May 2022) | Viewed by 396

Special Issue Editors

Key Laboratory of Control of Quality and Safety for Aquatic Products, Ministry of Agriculture, Chinese Academy of Fishery Sciences, Beijing 100141, China
Interests: soft material; carbon materials; electrochemical sensor; biosensors; food safety; environment monitoring
Flexible Electronics Innovation Institute, Jiangxi Science & Technology Normal University, Nanchang 330013, China
Interests: hydrogel; bioelectronic; conducting polymer; 3D printing
Key Lab for Special Functional Materials, School of Materials, Henan University, Kaifeng 475004, China
Interests: hydrogel; organogel; double network; coating; adhesion; toughness; superwettability

Special Issue Information

Dear Colleagues,

The development of flexible conductive electronic as wearable and conformable sensors, displays, and powering devices is making a huge impact on our daily lives. This Special Issue covers both organic and inorganic materials, as well as hybrid composite materials and devices for flexible electronics. Papers in the areas of soft materials synthesis, characterization, and modeling, along with device fabrication and testing, are requested. Papers demonstrating novel applications, including display, large-area sensors, functional devices, RFID tags, smart medical sensors, environmental monitoring, human–machine interactivity, robotics, communication and wireless networks, and paper-based devices will be considered. Novel, large area processing methods, such as 3D printing, ink-jet processing, spray pyrolysis, solution deposition, and roll-to-roll processing, are also of interest. Accordingly, this Special Issue seeks to showcase communications, research papers, and review articles.

Prof. Dr. Lidong Wu
Prof. Dr. Baoyang Lu
Prof. Dr. Xi Yao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible biosensors
  • flexible transistors
  • flexible pressure sensors
  • wearable electronics
  • integrated optoelectronic devices
  • flexible energy storage device
  • flexible systems

Published Papers

There is no accepted submissions to this special issue at this moment.
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