Dear Colleagues,

Enhancing the adhesion properties of solid interfaces between polymeric composites and other materials is one of the most important issues in materials science. The reason lies in the fact that the high adhesion strength of interfaces is essential to realize their practical application in film or paint coatings, joints, automobiles, aircraft, semiconductors, data-storage devices, thin-film transistors, flexible electronics, etc. Polymeric composites and hybrid materials usually offer improved properties compared to their constituents, but the compatibility of the interface between a substrate and polymeric composite strongly influences the structural response. However, the adhesion properties can be enhanced by the addition of interface modifiers, tailoring the chemical structure of the polymer matrix, and by using surface pre-treatments (mechanical, chemical, and physical).

This Special Issue aims to present a platform for researchers, in both academia and industry, in order to disseminate their ideas and most recent results in the field of the adhesive properties of composite materials. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

• Synthesis and characterization of novel composite adhesives, films, and coatings;
• The use of composite adhesives in the bonding of metals, polymers, and composites, including hybrid joining techniques;
• The use of surface pre-treatments, including mechanical, chemical, and physical treatments, in the improvement of the adhesive properties of polymeric composites;
• Interfacial study of polymeric composites;
• Mechanical characterization techniques for composite adhesives and joints, including the assessment of strength, fracture toughness, and long-term durability;
• In-service monitoring techniques of bonded joints’ performance;
• Experimental and numerical methods for evaluating the adhesion of polymeric composites;
• Applications of composite adhesives, i.e., dentistry, aerospace, electronics, automotive, etc.

We look forward to receiving your contributions.

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• adhesion
• adhesion enhancement
• composites
• coatings
• surface pre-treatments
• interfaces
• sustainable bonding
• joint strength
• fracture toughness
• modeling of joints