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Journals
Processes
Special Issues
Recent Advances in Cooling of Electronic Components
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Recent Advances in Cooling of Electronic Components

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Energy Systems".

Deadline for manuscript submissions: closed (20 May 2022) | Viewed by 2509

Special Issue Editor

Prof. Dr. Weikeng Lin

E-Mail Website
Guest Editor
Engineering & System Science Dept., Tsing-Hua University, Hsinchu 300, Taiwan
Interests: electronic cooling system; vapor chamber; heat pipe; CPL

Special Issue Information

Dear Colleagues,

"Thermal management" is an emerging industry that has grown rapidly in recent years. Its application areas include computer, communications, optoelectronics, automotive electronics, biomedical, aerospace, energy, and consumer electronics industries. The thermal-heat-dissipated products have a wide range of applications. According to estimates by the market research agency, the heat dissipation market is expected to grow from USD 25 billion to USD 36 billion from 2018 to 2023. In this, Server database centers and 5G-related equipment have the strongest heat-dissipated requirements. All these products have three major characteristics: (A) large market; (B) wide application; (C) many business opportunities. In summary, various application business opportunities can be derived, and related equipment will encounter heat dissipation requirements and market business opportunities as can be expected.

  This Special Issue of "Recent Advances in Cooling of Electronic Components" will contain the results of the most advanced and latest research. It will particularly focus on the development of new generation heat-dissipated component technology and its performance measurement technology, the application of new materials on the heat-dissipated field, and the development of next-generation heat dissipation component technology. The topics covered in this issue comprise, but are not limited to, ‎the following items:

  • Measuring technology for the thermal performance of heat-dissipated elements;
  • New technologies for heat conduction and heat dissipation;
  • Development of new heat dissipated materials;
  • New heat storage systems;
  • Cooling technology of electric vehicle motor and battery;
  • Graphene and ultra-thin vapor chamber application of 5G mobile phone.

Prof. Dr. Weikeng Lin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • heat dissipated materials
  • electronic cooling technology
  • heat pipe
  • vapor chamber
  • thermal performance
  • graphite graphene battery cooling

Published Papers (1 paper)

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Research

20 pages, 5511 KiB  
Article
Heat Transfer Performance of Plate Fin and Pin Fin Heat Sinks Using Al2O3/H2O Nanofluid in Electronic Cooling
by Oguzhan Ozbalci, Ayla Dogan and Meltem Asilturk
Processes 2022, 10(8), 1644; https://0-doi-org.brum.beds.ac.uk/10.3390/pr10081644 - 18 Aug 2022
Cited by 2 | Viewed by 2028
Abstract
The thermal management of electronic devices has become a major problem in recent years. Therefore, there is a growing need for research on many new materials and innovative fluids due to the developing technology and increasing cooling need in electronic systems. In this [...] Read more.
The thermal management of electronic devices has become a major problem in recent years. Therefore, there is a growing need for research on many new materials and innovative fluids due to the developing technology and increasing cooling need in electronic systems. In this paper, heat transfer from a plate fin and pin fin type heat sinks that were placed in a water block that are used in electronic systems was investigated. A base fluid (pure water) and 0.1% mass concentration Al2O3-H2O nanofluid were used as cooling fluids. The experiments were carried out for volumetric flow rates varying between 100 and 800 mL/min and heat flux values of 454.54 W/m2 and 1818.18 W/m2. The results demonstrated that the Al2O3-H2O nanofluid on the empty surface provided a maximum improvement of 10.5% in heat transfer compared to the base fluid. In the use of plate finned heat sink, the maximum amount of improvement in heat transfer compared to the empty surface was obtained approximately 64.25% for the base fluid and 82.8% for the nanofluid. A similar comparison was made for the pin-fin heat sink, a maximum thermal improvement of 56.4% in the base fluid and 70.27% in the use of nanofluid was determined. Full article
(This article belongs to the Special Issue Recent Advances in Cooling of Electronic Components)
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