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Sensors for Nondestructive Testing
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Sensors for Nondestructive Testing

A special issue of Sensors (ISSN 1424-8220).

Deadline for manuscript submissions: closed (31 March 2021) | Viewed by 3668

Special Issue Editors

Prof. Dr. Dimitrios G. Aggelis

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Guest Editor
Department of Mechanics of Materials and Constructions, Vrije Universiteit Brussel, Pleinlaan 2, 1050 Brussels, Belgium
Interests: structural health monitoring (shm); non-destructive evaluation (nde); acoustic emission (ae); ultrasonic testing (ut); scattering; dispersion; attenuation; material evaluation; concrete
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Danny Van Hemelrijck

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Guest Editor
Mechanics of Materials and Construction, Vrije Universiteit Brussel, Belgium
Interests: (Elastic waves, optical techniques, electronic speckle pattern interferometry, photoelasticity, thermoelasticity, polymer composites, metals)

Special Issue Information

Dear Colleagues,

Intelligent sensor technologies will revolutionize our everyday lives, providing safety, security, surveillance, monitoring, automation, and awareness in general. They drive innovation in many industrial applications and are vital for progress in medicine. Miniaturization through micro- and nanotechnology, novel materials and intelligent, networked, and integrated devices are key for future developments and improved performance. In addition, new engineering demands dictate a continuously improving characterization of the materials and components used in modern life. In all fields of science and engineering, standards of safety, productivity, and quality are rising. The absolute control which is necessary to raise these standards is achieved by means of sensors, which are the cornerstone in order to perform accurate characterization in any type of condition monitoring approach and any material field. The present Special Issue intends to explore new developments in sensors technology for nondestructive testing and modern applications in all domains of materials and processes. Topics include (but are not limited to):

  • Advancement in optical techniques (photoelasticity, interferometry, DIC, DVC, etc.);
  • Advances in sensor technology;
  • Biosensors;
  • Contactless ultrasonic sensors;
  • Elastic waves (ultrasonics, acoustic emission);
  • Electromagnetic antennas, radar, mmW;
  • Embedded sensors;
  • Energy harvesting for NDT;
  • Fiber sensors;
  • Infrared sensing;
  • Nanosensors;
  • Sensors for cultural heritage items;
  • Sensors for durability and durability of sensors.

In addition to developments in the sensor technology itself, the issue welcomes novel applications of sensors in materials and processes.

Prof. Dr. Dimitrios Aggelis
Prof. Dr. Danny Van Hemelrijck
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • acoustic emission
  • elastic waves
  • ultrasonics
  • digital image correlation
  • pressure sensors
  • infrared sensors
  • biosensors
  • embedded sensors
  • infrared
  • electromagnetic
  • nanonsensors
  • contactless sensors

Published Papers (1 paper)

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Research

20 pages, 8512 KiB  
Article
Air-Coupled Reception of a Slow Ultrasonic A0 Mode Wave Propagating in Thin Plastic Film
by Rymantas J. Kazys and Almantas Vilpisauskas
Sensors 2020, 20(2), 516; https://0-doi-org.brum.beds.ac.uk/10.3390/s20020516 - 16 Jan 2020
Cited by 7 | Viewed by 2739
Abstract
At low frequencies, in thin plates the phase velocity of the guided A0 mode can become slower than that of the ultrasound velocity in air. Such waves do not excite leaky waves in the surrounding air, and therefore, it is impossible to [...] Read more.
At low frequencies, in thin plates the phase velocity of the guided A0 mode can become slower than that of the ultrasound velocity in air. Such waves do not excite leaky waves in the surrounding air, and therefore, it is impossible to excite and receive them by conventional air-coupled methods. The objective of this research was the development of an air-coupled technique for the reception of slow A0 mode in thin plastic films. This study demonstrates the feasibility of picking up a subsonic A0 mode in plastic films by air-coupled ultrasonic arrays. The air-coupled reception was based on an evanescent wave in air accompanying the propagating A0 mode in a film. The efficiency of the reception was enhanced by using a virtual array which was arranged from the data collected by a single air-coupled receiver. The signals measured at the points corresponding to the positions of the phase-matched array were recorded and processed. The transmitting array excited not only the A0 mode in the film, but also a direct wave in air. This wave propagated at ultrasound velocity in air and was faster than the evanescent wave. For efficient reception of the A0 mode, the additional signal-processing procedure based on the application of the 2D Fourier transform in a spatial–temporal domain. The obtained results can be useful for the development of novel air-coupled ultrasonic non-destructive testing techniques. Full article
(This article belongs to the Special Issue Sensors for Nondestructive Testing)
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