Flexible Gel Sensor: From Design to Application

A special issue of Gels (ISSN 2310-2861). This special issue belongs to the section "Gel Processing and Engineering".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 148

Special Issue Editor


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Guest Editor
State Key Laboratory of Organic Electronics and Information Displays & Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, Nanjing 210023, China
Interests: hydrogel; flexible electronics; microstructure; printing

Special Issue Information

Dear Colleagues,

Flexible gel sensors represent an exciting advancement in materials science and sensing technology. Based on hydrogels and elastomers, these sensors can conform to curved surfaces, repeatedly stretch and deform, and detect stimuli such as pressure, strain, and humidity. Their flexibility and versatility make them well-suited for applications including wearable electronics, soft robotics, and health monitoring. However, designing and optimizing these sensors requires expertise across multiple disciplines including chemistry, mechanics, electronics, and manufacturing. This Special Issue aims to bring together the latest interdisciplinary research on the design, fabrication, characterization, and implementation of flexible gel sensors. Contributions will cover fundamental studies on gel chemistry and mechanics as well as applied research on integrating these unique materials into functional devices. By providing a comprehensive look at the current state and future potential of flexible gel sensor technology, this Special Issue will foster collaboration across fields and accelerate development of innovative new applications.

Dr. Weiwei Zhao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Gels is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • hydrogel materials
  • preparation technology
  • mechanical properties
  • portable electronics
  • wearable electronics

Published Papers

This special issue is now open for submission.
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