Digital Image Correlation (DIC) Analysis in Metal Forming Processes

Dear Colleagues,

Digital Image Correlation (DIC) is a methodology that basically compares images, taken at different time intervals, of two or more surfaces to obtain quantitative measurement of motions and deformations. It originated at the University of South Carolina in the early 1980s, when in 1982 Cheng and Sutton focused on the use of images from a single camera to extract local surface deformations.

Since then, the application of different DIC techniques and methodologies has been increasing and they are used by many researchers. DIC is applied in sectors such as: aerospace, automotive, industry, research, military, biomechanics, electronics, etc. Advances in imaging technology are improving DIC, such as recent developments on high and ultra-high speed ​​imaging. In addition, the cost of digital imaging equipment is getting cheaper, and for example, high-speed equipment has a lower price than years ago, and speeds are increasing.

DIC techniques are easy to implement and can measure displacements to 1/100^th of a pixel. Their flexibility and multidisciplinary nature allow DIC to be used in many applications: high-speed displacement and strain, grain-scale strain measurements, and parameter identification. It is also possible to combine several DIC systems for 360-degree measuring. Particularly in metals forming, DIC techniques are mainly used for: characterization, identification, cross-validation and control of mechanical parameters in testing machines.

This special issue aims to collect the recent progress in DIC applied to metal forming, regardless of the imaging technique used (regular and high-speed cameras, SEM, AFM, CT, X-ray, ...). Researchers are invited to submit regular papers, short communications, and review articles, featuring their contributions in this field, ranging from early-stage developments to full scale-up applications, comprising the use of DIC applied to metal forming.

Prof. Dr. Miguel Angel Selles Canto
Prof. Dr. Samuel Sanchez Caballero
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• Digital Image Correlation
• Stereo Digital Image Correlation
• Digital Volume Correlation
• Particle Image Velocimetry
• Digital Image Correlation Measurement
• Single Point Measurements
• Surface Deformation
• Camera Calibration
• DIC implementation
• Micro- and Nano-Scale Testing
• DIC on Damage Development
• Metal Forming
• DIC for Metal Processes