Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
Abstract
:1. Introduction
2. Materials and Methods
3. Results and Discussion
3.1. Initial Microsturutures
3.2. Effect of Ni Addition on Tensile Properties of Sn-6.4Sb-3.9Ag
3.3. Effect of Ni Addition on Fatigue Properties of Sn-6.4Sb-3.9Ag
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Chemical Composition [Mass%] | Solidus Temperature [°C] | Liquidus Temperature [°C] |
---|---|---|
Sn-6.4Sb-3.9Ag | 230.4 | 234.8 |
Sn-6.4Sb-3.9Ag-0.03Ni | 225.3 | 234.3 |
Sn-6.4Sb-3.9Ag-0.4Ni | 226.3 | 233.8 |
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Yamamoto, M.; Shohji, I.; Kobayashi, T.; Mitsui, K.; Watanabe, H. Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder. Materials 2021, 14, 3799. https://0-doi-org.brum.beds.ac.uk/10.3390/ma14143799
Yamamoto M, Shohji I, Kobayashi T, Mitsui K, Watanabe H. Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder. Materials. 2021; 14(14):3799. https://0-doi-org.brum.beds.ac.uk/10.3390/ma14143799
Chicago/Turabian StyleYamamoto, Mizuki, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, and Hirohiko Watanabe. 2021. "Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder" Materials 14, no. 14: 3799. https://0-doi-org.brum.beds.ac.uk/10.3390/ma14143799