Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting
Abstract
:1. Introduction
2. Materials and Methods
3. Results and Discussion
3.1. Process Optimization
3.2. Effects of Oxygen Plasma Activation on the Polyimide Surface
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Group | O2 Plasma Activation | H2O |
---|---|---|
#1 | × | × |
#2 | × | √ |
#3 | √ | × |
#4 | √ | √ |
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Meng, Y.; Gao, R.; Wang, X.; Huang, S.; Wei, K.; Wang, D.; Mu, F.; Liu, X. Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials 2022, 15, 2529. https://0-doi-org.brum.beds.ac.uk/10.3390/ma15072529
Meng Y, Gao R, Wang X, Huang S, Wei K, Wang D, Mu F, Liu X. Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials. 2022; 15(7):2529. https://0-doi-org.brum.beds.ac.uk/10.3390/ma15072529
Chicago/Turabian StyleMeng, Ying, Runhua Gao, Xinhua Wang, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu, and Xinyu Liu. 2022. "Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting" Materials 15, no. 7: 2529. https://0-doi-org.brum.beds.ac.uk/10.3390/ma15072529