Next Article in Journal
High-Throughput Synthesis of Liposome Using an Injection-Molded Plastic Micro-Fluidic Device
Next Article in Special Issue
A Hybrid Fuzzy Decision Model for Evaluating MEMS and IC Integration Technologies
Previous Article in Journal
Research on DOA Estimation Based on Acoustic Energy Flux Detection Using a Single MEMS Vector Hydrophone
Previous Article in Special Issue
Analysis of Frequency Drift of Silicon MEMS Resonator with Temperature
 
 

Order Article Reprints

Journal: Micromachines, 2021
Volume: 12
Number: 169

Article: A RF Redundant TSV Interconnection for High Resistance Si Interposer
Authors: by Mengcheng Wang, Shenglin Ma, Yufeng Jin, Wei Wang, Jing Chen, Liulin Hu and Shuwei He
Link: https://0-www-mdpi-com.brum.beds.ac.uk/2072-666X/12/2/169

MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.

If you have any questions, or special requests, please write to our support team; we are happy to provide you with the information you need.

Reprint Options

If you need more than 400 copies, please contact us by e-mail (publisher@mdpi.com) and we will prepare an individual offer for you.

Order Cost and Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop