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Journal: Nanomaterials, 2022
Volume: 12
Number: 3893

Article: Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate
Authors: by Jae-Young Bae, Man-Hyup Han, Seung-Jae Lee, Eun-Seong Kim, Kyungsik Lee, Gon-sub Lee, Jin-Hyung Park and Jea-Gun Park
Link: https://0-www-mdpi-com.brum.beds.ac.uk/2079-4991/12/21/3893

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