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Journal: Electronics, 2022
Volume: 11
Number: 849

Article: Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Authors: by Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra and Ali Roshanghias
Link: https://0-www-mdpi-com.brum.beds.ac.uk/2079-9292/11/6/849

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