Collection of Review Papers on Thin Film Deposition

Dear Colleagues,

Thin films are a modern technology aimed at improving the structural, electrical, magnetic, optical, and mechanical properties of bulk materials. This technology has so far found applications in integrated circuits, semiconductor devices, transistors, light-emitting diodes, light crystal displays and photoconductors, rectifiers, solar cells, sensors, and micro-electromechanical systems. There are various techniques for manufacturing thin films, which include atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), molecular beam epitaxy (MBE), sputtering, electron beam evaporation, laser ablation, cathodic arc, and pulsed laser deposition (PLD). Thin film technology offers a lucrative scheme of creating engineered surfaces and opens a wide exploration of prospects to modify material properties for specific applications, such as those that depend on surfaces. This review paper reports on the different types and groups of superconductors, fabrication of thin film superconductors by MBE, PLD, and ALD, their applications, and various challenges faced by superconductor technologies. Amongst all the thin film manufacturing techniques, more focus is put on the fabrication of thin film superconductors by atomic layer deposition because of the growing popularity of the process over the past decade.

This Topical Collection will serve as a forum for papers in the following concepts:

• Theoretical and experimental research, knowledge, and new ideas in thin film deposition;
• Finite element method simulation of affecting factors during metal thin film deposition;
• Research on thin film deposition rate deposited by sputtering;
• Effect of plasma parameters on thin film deposition;
• The latest development of test methods considering the interplay between mechanical, chemical, and electrochemical interactions and the ability to predict performance and/or reliability. Emphasis on valid, accelerated performance tests and the relation between test technique and field performance data;
• Application and development of computer simulation in thin film deposition.

Prof. Dr. Fuzhang Wang
Collection Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the collection website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• atomic layer deposition
• chemical vapor deposition
• physical vapor deposition
• molecular beam epitaxy
• pulsed laser deposition