Electronic Devices for Bio-Medical Applications

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Bioelectronics".

Deadline for manuscript submissions: 15 November 2024 | Viewed by 72

Special Issue Editor

Department of Chemical Engineering, Stanford University, 443 Via Ortega, Stanford, CA 94305, USA
Interests: flexible and stretchable electronics; stretchable encapsulation; bio-interfaces; sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

While COVID-19's grip may be loosening, its enduring impact continues to afflict millions of people around the world, underscoring the pressing need for advancements in bioelectronics. Despite significant strides made by industry and academia, a gap between existing biomedical devices and techniques remains, and the demand for more effective, efficient, bio-compatible, and affordable innovations has escalated.

To address this need, this Special Issue seeks submissions that demonstrate substantial contributions to the field of electronics within the context of biomedical applications. We invite research on recent advancements in non-invasive treatments, advanced materials for biocompatibility applications, and innovative biomedical devices. Potential topics include, but are not limited to, drug delivery and dosage control, stretchable bioelectronics, spray-on skin, and biocompatible materials for prosthetics.

Through the publication of research, reviews, and perspective articles covering a broad spectrum of topics, this Special Issue aims to offer a comprehensive standpoint on bioelectronics. We aim to facilitate collaboration and knowledge exchange among esteemed researchers from academia and industry alike. Experts from all disciplines are encouraged to contribute, advancing our collective understanding of biomedical engineering.

Technical Committee Member

Title: Mr.
Name: Donglin (Tony) Li
Affiliation: Department of Materials Science & Engineering, Stanford University, 496 Lomita Mall, Stanford, CA 94305, USA
Homepage: https://profiles.stanford.edu/donglin-li
E-mail: [email protected]
Interests: battery materials for fast-charging applications; advanced electronic devices; the synthesis and fabrication of materials

Dr. Yepin Zhao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • bioelectronics
  • biomedical engineering
  • biocompatibility
  • stretchable circuits
  • bio-sensors
  • biomimetic structure
  • drug delivery
  • prosthetics

Published Papers

This special issue is now open for submission.
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