3D Heterogeneous Integration and Advanced Semiconductor Packaging

In the post-Moore’s Law era of the semiconductor and microelectronics industry, traditional silicon technology scaling alone will provide a diminishing cost and performance improvements. Integrating heterogeneous materials, devices, and circuits through advanced packaging into a tightly coupled 3D system is emerging as the productivity driver of the future. Heterogeneous integration uses fine-pitch packaging technology to integrate separately manufactured dissimilar silicon chips (e.g., logic, memory, RF/analog) into a higher-level system or subsystem in the same 3D package with performance that exceeds what is available from today’s monolithic approach. More broadly, heterogenous integration is to integrate devices and circuits from different materials with different functions into a 3D system-in-package. Such heterogeneously integrated materials could be silicon, compound semiconductors, functional oxides, organic semiconductors, ionic solids, phase change materials, and others, and they can function as electronic, RF/microwave, photonic, sensing, and energy devices. Furthermore, the concept of heterogeneous integration also expands to integrating different materials on the same wafer via heteroepitaxial growth, wafer bonding, and other traditional technologies widely used for semiconductor photonics, power electronics, RF/microwave electronics, MEMS, and others.

This Special Issue aims to report recent advances in microelectronics packaging and 3D heterogeneous integration, including but not limited to architecture design, process development, characterization and performance evaluation, metrology tools, and much more. Functional demonstrations of heterogeneous integration for various applications are welcome, such as computing, communication, sensing, display, neuromorphic and artificial intelligence, smartphones, wearable sensors and electronics, energy harvesting, storage, power management, and much more.

We are confident that the publication of such a Special Issue will stimulate the curiosity of researchers to explore the heterogeneous integration of various materials, devices, and circuits to further advance the development of microelectronics and microsystems. It is our pleasure to invite you to submit a manuscript aligned with this broad subject for this Special Issue. Full papers, communications, and reviews are all welcome.

Prof. Dr. Zhaoyang Fan
Guest Editor

Manuscript Submission Information

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• heterogeneous integration
• 3D integration
• chip stacking
• semiconductor packaging
• system-in-package
• system integration