Laser-Assisted Processing and Manufacturing

A special issue of Journal of Manufacturing and Materials Processing (ISSN 2504-4494).

Deadline for manuscript submissions: 31 December 2024 | Viewed by 87

Special Issue Editors


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Guest Editor
Department of Mechanical and Materials Engineering, College of Engineering and Applied Science, University of Cincinnati, Cincinnati, OH 45221, USA
Interests: laser additive manufacturing; laser surface treatment; laser synthesis of alloys; 3D printing; system modeling and optimization; Industry 4.0; energy storage; renewable energy
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Aerospace and Mechanical Engineering, Saint Louis University, St. Louis, MO 63103, USA
Interests: laser-assisted/laser machining of advanced materials; laser peening; computational solid mechanics; multi-scale modeling of manufacturing processes; micro-machining and nano-machining

Special Issue Information

Dear Colleagues,

Lasers have been extensively adopted for materials processing and manufacturing due to their distinct advantages in precision, speed, versatility, and non-contact nature. The applications of laser material processing, such as laser welding, laser machining, laser heat treatment, and laser surface treatment, are well-known and have generated tremendous impact on industries. In recent years, emerging applications such as laser additive manufacturing and laser-induced crystallization have also been witnessed. Meanwhile, the recent developments of laser technologies, such as ultrafast lasers, ultra-high-power lasers, green and UV lasers, laser beam combining, and laser beam shaping, have further enabled the advancement of laser manufacturing applications.

This Special Issue aims to collect state-of-the-art research in the broad area of laser-assisted processing and manufacturing. The topics include, but are not limited to, laser-material interaction, manufacturing process innovations, emerging applications, performance and quality enhancement, process–microstructure–performance relationships, and novel laser technologies. Both research and review articles are welcome.

We look forward to receiving your submissions.

Prof. Dr. Jing Shi
Dr. Jeff Ma
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser–material interaction
  • laser processing and manufacturing
  • laser-assisted processing and manufacturing
  • laser additive manufacturing
  • emerging applications
  • new laser technologies
  • modeling and simulation
  • process monitoring
  • microstructure and performance enhancement

Published Papers

This special issue is now open for submission.
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