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Micromachines
Special Issues
Two-Dimensional Materials for Advanced Electronic Devices
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Two-Dimensional Materials for Advanced Electronic Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: closed (10 March 2022) | Viewed by 8820

Special Issue Editor

Dr. MinA Kang

E-Mail Website
Guest Editor
Fibre and Polymer Technology, School of Engineering Sciences in Chemistry, Biotechnology and Health, KTH Royal Institute of Technology, 114 28 Stockholm, Sweden
Interests: 2D materials; material engineering; soft-lithography; sensors; organic electrochemical transistor; photodetector; gas sensors

Special Issue Information

Dear Colleagues,

Emerging two-dimensional (2D) materials, including graphene, transition metal dichalcogenides (TMDs), and Mxene, have attracted an increasing amount of interest due to their extraordinary unique features, such as atomically thin structures, superior bendability, and high electrical properties. Graphene and two-dimensional layered materials are extensively used for the development of fundamental technology and various industries, such as the Internet of Things, flexible electronics, ultra-low power devices, next-generation batteries, etc.

In recent years, enormous efforts have been made to synthesize high-quality atomically thin films with excellent electrical properties and at the same time to achieve great reactivity to chemical species by controlling the specific surface area. However, there is still a need for tremendous efforts to further improve the feasibility of application as next-generation devices using two-dimensional materials as well as intrinsic fundamental characteristics and experimental proof. We invite you to submit your research results related to “Two-Dimensional Materials for Advanced Electronic Devices”.

The aim of this Special Issue is to provide an extraordinary international platform that can enable researchers to issue the latest developments on the following topics:

  • Graphene and two-dimensional layered materials engineering: surface, interface, heterostructure, composite, functionalization, alloying, passivation, etching, etc.;
  • Characterization of the nanostructure;
  • Advanced application based on Graphene and two-dimensional layered materials: electronics, sensor, energy storage, etc.

Dr. MinA Kang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Two-Dimensional Materials
  • Material Engineering
  • Soft Lithography Method
  • Flexible Electronics
  • Organic Electrochemical Transistors
  • Photodetectors
  • Gas Sensors
  • Chemical Vapor Deposition Method
  • Self-Assembly Process

Published Papers (3 papers)

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Research

11 pages, 5165 KiB  
Article
Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for Ultrahigh-Voltage Device Applications
by Wenting Zhang, Caorui Zhang, Junmin Wu, Fei Yang, Yunlai An, Fangjing Hu and Ji Fan
Micromachines 2021, 12(12), 1575; https://0-doi-org.brum.beds.ac.uk/10.3390/mi12121575 - 17 Dec 2021
Cited by 3 | Viewed by 2688
Abstract
SiC direct bonding using O2 plasma activation is investigated in this work. SiC substrate and n− SiC epitaxy growth layer are activated with an optimized duration of 60s and power of the oxygen ion beam source at 20 W. After O [...] Read more.
SiC direct bonding using O2 plasma activation is investigated in this work. SiC substrate and n− SiC epitaxy growth layer are activated with an optimized duration of 60s and power of the oxygen ion beam source at 20 W. After O2 plasma activation, both the SiC substrate and n− SiC epitaxy growth layer present a sufficient hydrophilic surface for bonding. The two 4-inch wafers are prebonded at room temperature followed by an annealing process in an atmospheric N2 ambient for 3 h at 300 °C. The scanning results obtained by C-mode scanning acoustic microscopy (C-SAM) shows a high bonding uniformity. The bonding strength of 1473 mJ/m2 is achieved. The bonding mechanisms are investigated through interface analysis by transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDX). Oxygen is found between the two interfaces, which indicates Si–O and C–O are formed at the bonding interface. However, a C-rich area is also detected at the bonding interface, which reveals the formation of C-C bonds in the activated SiC surface layer. These results show the potential of low cost and efficient surface activation method for SiC direct bonding for ultrahigh-voltage devices applications. Full article
(This article belongs to the Special Issue Two-Dimensional Materials for Advanced Electronic Devices)
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8 pages, 440 KiB  
Article
Investigation of Interaction of Noble Metals (Cu, Ag, Au, Pt and Ir) with Nanosheets
by Mansoor H. Alshehri
Micromachines 2021, 12(8), 906; https://0-doi-org.brum.beds.ac.uk/10.3390/mi12080906 - 29 Jul 2021
Cited by 2 | Viewed by 1678
Abstract
Two-dimensional nanomaterials, such as graphene and hexagonal boron nitride nanosheets, have attracted tremendous interest in the research community and as a starting point for the development of nanotechnology. Using classical applied mathematical modeling, we derive explicit analytical expressions to determine the binding energies [...] Read more.
Two-dimensional nanomaterials, such as graphene and hexagonal boron nitride nanosheets, have attracted tremendous interest in the research community and as a starting point for the development of nanotechnology. Using classical applied mathematical modeling, we derive explicit analytical expressions to determine the binding energies of noble metals, including copper, silver, gold, platinum and iridium (Cu, Ag, Au, Pt and Ir) atoms, on graphene and hexagonal boron nitride nanosheets. We adopt the 6–12 Lennard–Jones potential function, together with the continuous approach, to determine the preferred minimum energy position of an offset metal atom above the surface of the graphene and hexagonal boron nitride nanosheets. The main results of this study are analytical expressions of the interaction energies, which we then utilize to report the mechanism of adsorption of the metal atoms on graphene and hexagonal boron nitride surfaces. The results show that the minimum binding energy occured when Cu, Ag, Au, Pt and Ir were set at perpendicular distances in the region from 3.302 Å to 3.683 Å above the nanosheet surface, which correspond to adsorption energies in the region ranging from 0.842 to 2.978 (kcal/mol). Our results might assist in providing information on the interaction energies between the metal atoms and the two-dimensional nanomaterials. Full article
(This article belongs to the Special Issue Two-Dimensional Materials for Advanced Electronic Devices)
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12 pages, 4201 KiB  
Article
Micromask Lithography for Cheap and Fast 2D Materials Microstructures Fabrication
by Mikhail V. Pugachev, Aliaksandr I. Duleba, Arslan A. Galiullin and Aleksandr Y. Kuntsevich
Micromachines 2021, 12(8), 850; https://0-doi-org.brum.beds.ac.uk/10.3390/mi12080850 - 21 Jul 2021
Cited by 11 | Viewed by 3545
Abstract
The fast and precise fabrication of micro-devices based on single flakes of novel 2D materials and stacked heterostructures is vital for exploration of novel functionalities. In this paper, we demonstrate a fast high-resolution contact mask lithography through a simple upgrade of metallographic optical [...] Read more.
The fast and precise fabrication of micro-devices based on single flakes of novel 2D materials and stacked heterostructures is vital for exploration of novel functionalities. In this paper, we demonstrate a fast high-resolution contact mask lithography through a simple upgrade of metallographic optical microscope. Suggested kit for the micromask lithography is compact and easily compatible with a glove box, thus being suitable for a wide range of air-unstable materials. The shadow masks could be either ordered commercially or fabricated in a laboratory using a beam lithography. The processes of the mask alignment and the resist exposure take a few minutes and provide a micrometer resolution. With the total price of the kit components around USD 200, our approach would be convenient for laboratories with the limited access to commercial lithographic systems. Full article
(This article belongs to the Special Issue Two-Dimensional Materials for Advanced Electronic Devices)
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