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Micromachines
Special Issues
Flexible and Wearable Sensors, and Systems
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Flexible and Wearable Sensors, and Systems

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (29 February 2024) | Viewed by 2466

Special Issue Editors

Prof. Dr. Yang Li

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Guest Editor
School of Microelectronics, Shandong University, Jinan 250101, China
Interests: flexible electronics; nonvolatile memory devices
Special Issues, Collections and Topics in MDPI journals
Dr. La Li

E-Mail Website
Guest Editor
School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
Interests: flexible energy storage; self-powered integrated system
Special Issues, Collections and Topics in MDPI journals
Dr. Zuqing Yuan

E-Mail Website
Guest Editor
School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing, China
Interests: flexible tactile sensor and intelligent robot application
Prof. Dr. Guozhen Shen

grade E-Mail Website
Guest Editor
State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Interests: flexible electronics; printable electronics; sensors; nanoelectronics

Special Issue Information

Dear Colleagues,

Wearable technology with widespread public attention has generated tremendous economic and social impact, resulting in changes in healthcare procedures and personal lifestyles. Wearable sensing devices or systems, as an important type of component in wearable technology which can detect various stimuli relevant to biological species or specific environments, have recently seen a large increase in both commercialization and research. Over the past few years, the research direction in this field has focused mainly on the development of flexible, lightweight, self-powered, miniaturized, and integrated wearable systems. Until now, the key points of the above-mentioned studies are still an important direction for flexible electronics. Therefore, a Special Issue of flexible and wearable electronics from low-level devices to top-level systems is needed to further promote progress in this field. It is believed that this Special Issue will have a significant impact on many fields of flexible electronics, which is beneficial to promote the cross-integration of multiple fields and accelerate the development of flexible electronic devices.

Prof. Dr. Yang Li
Dr. La Li
Dr. Zuqing Yuan
Prof. Dr. Guozhen Shen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible/wearable sensors
  • integrated systems
  • flexible electronics

Published Papers (2 papers)

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Research

12 pages, 2426 KiB  
Article
Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes
by Yingyu Xu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang and Guizhen Yan
Micromachines 2023, 14(10), 1956; https://0-doi-org.brum.beds.ac.uk/10.3390/mi14101956 - 20 Oct 2023
Viewed by 1002
Abstract
MEMS gyroscopes are widely applied in consumer electronics, aerospace, missile guidance, and other fields. Reliable packaging is the foundation for ensuring the survivability and performance of the sensor in harsh environments, but gas leakage models of wafer-level MEMS gyroscopes are rarely reported. This [...] Read more.
MEMS gyroscopes are widely applied in consumer electronics, aerospace, missile guidance, and other fields. Reliable packaging is the foundation for ensuring the survivability and performance of the sensor in harsh environments, but gas leakage models of wafer-level MEMS gyroscopes are rarely reported. This paper proposes a gas leakage model for evaluating the packaging reliability of wafer-level MEMS gyroscopes. Based on thermodynamics and hydromechanics, the relationships between the quality factor, gas molecule number, and a quality factor degradation model are derived. The mechanism of the effect of gas leakage on the quality factor is explored at wafer-level packaging. The experimental results show that the reciprocal of the quality factor is exponentially related to gas leakage time, which is in accordance with the theoretical analysis. The coefficients of determination (R2) are all greater than 0.95 by fitting the curves in Matlab R2022b. The stable values of the quality factor for drive mode and sense mode are predicted to be 6609.4 and 1205.1, respectively, and the average degradation characteristic time is 435.84 h. The gas leakage time is at least eight times the average characteristic time, namely 3486.72 h, before a stable condition is achieved in the packaging chamber of the MEMS gyroscopes. Full article
(This article belongs to the Special Issue Flexible and Wearable Sensors, and Systems)
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13 pages, 4430 KiB  
Article
Low-Temperature Adaptive Dual-Network MXene Nanocomposite Hydrogel as Flexible Wearable Strain Sensors
by Kai Chen, Wenzhong Lai, Wangchuan Xiao, Lumin Li, Shijun Huang and Xiufeng Xiao
Micromachines 2023, 14(8), 1563; https://0-doi-org.brum.beds.ac.uk/10.3390/mi14081563 - 6 Aug 2023
Cited by 2 | Viewed by 1158
Abstract
Flexible electronic devices and conductive materials can be used as wearable sensors to detect human motions. However, the existing hydrogels generally have problems of weak tensile capacity, insufficient durability, and being easy to freeze at low temperatures, which greatly affect their application in [...] Read more.
Flexible electronic devices and conductive materials can be used as wearable sensors to detect human motions. However, the existing hydrogels generally have problems of weak tensile capacity, insufficient durability, and being easy to freeze at low temperatures, which greatly affect their application in the field of wearable devices. In this paper, glycerol was partially replaced by water as the solvent, agar was thermally dissolved to initiate acrylamide polymerization, and MXene was used as a conductive filler and initiator promoter to form the double network MXene-PAM/Agar organic hydrogel. The presence of MXene makes the hydrogel produce more conductive paths and enforces the hydrogel’s higher conductivity (1.02 S·m−1). The mechanical properties of hydrogels were enhanced by the double network structure, and the hydrogel had high stretchability (1300%). In addition, the hydrogel-based wearable strain sensor exhibited good sensitivity over a wide strain range (GF = 2.99, 0–200% strain). The strain sensor based on MXene-PAM/Agar hydrogel was capable of real-time monitoring of human movement signals such as fingers, wrists, arms, etc. and could maintain good working conditions even in cold environments (−26 °C). Hence, we are of the opinion that delving into this hydrogel holds the potential to broaden the scope of utilizing conductive hydrogels as flexible and wearable strain sensors, especially in chilly environments. Full article
(This article belongs to the Special Issue Flexible and Wearable Sensors, and Systems)
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