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Micromachines
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MEMS Mechanical Sensing Device
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MEMS Mechanical Sensing Device

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (15 March 2022) | Viewed by 5020

Special Issue Editor

Dr. Hidetoshi Takahashi

E-Mail Website
Guest Editor
Department of Mechanical Engineering, Faculty of Science and Technology, Keio University, Kanagawa 223-8522, Japan
Interests: MEMS; force sensor; biomechanics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Mechanical sensing devices in the microelectromechanical system (MEMS) field have been studied and developed over the past few decades. One of the most common MEMS mechanical sensing devices is a pressure sensor that includes the application of small microphones. Accelerators and Coriolis vibratory gyroscopes are famous MEMS mechanical sensing devices because these detects the target physical quantity via their mechanical deformation. In recent years, tactile sensors, including multi-axis force sensors and flexible sensor sheets, have been further studied as applicable to robots. There are also many researches that measure physical quantity such as temperature or chemical quantities as mechanical deformations. The sensing elements of these sensors, a piezoresistive, piezoelectric, and capacitive element, have been developed to realize sufficiently sensitive measurements. In the present IoT age, MEMS mechanical sensing devices are one of the most suitable devices to monitor physical phenomena, because of their size, power consumption, and compatibility for communication devices. Accordingly, this Special Issue seeks to showcase research papers, and review articles that focus on novel developments in MEMS mechanical sensing devices, and their use for various applications.

Dr. Hidetoshi Takahashi
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS
  • mechanical sensors
  • force and torque sensors
  • displacement and rotation sensors
  • inertial pressure sensors
  • tactile sensors
  • stress and strain sensors

Related Special Issue

Published Papers (2 papers)

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Research

17 pages, 6984 KiB  
Article
Self-Calibration Technique with Lightweight Algorithm for Thermal Drift Compensation in MEMS Accelerometers
by Javier Martínez, David Asiain and José Ramón Beltrán
Micromachines 2022, 13(4), 584; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13040584 - 08 Apr 2022
Cited by 6 | Viewed by 1724
Abstract
Capacitive MEMS accelerometers have a high thermal sensitivity that drifts the output when subjected to changes in temperature. To improve their performance in applications with thermal variations, it is necessary to compensate for these effects. These drifts can be compensated using a lightweight [...] Read more.
Capacitive MEMS accelerometers have a high thermal sensitivity that drifts the output when subjected to changes in temperature. To improve their performance in applications with thermal variations, it is necessary to compensate for these effects. These drifts can be compensated using a lightweight algorithm by knowing the characteristic thermal parameters of the accelerometer (Temperature Drift of Bias and Temperature Drift of Scale Factor). These parameters vary in each accelerometer and axis, making an individual calibration necessary. In this work, a simple and fast calibration method that allows the characteristic parameters of the three axes to be obtained simultaneously through a single test is proposed. This method is based on the study of two specific orientations, each at two temperatures. By means of the suitable selection of the orientations and the temperature points, the data obtained can be extrapolated to the entire working range of the accelerometer. Only a mechanical anchor and a heat source are required to perform the calibration. This technique can be scaled to calibrate multiple accelerometers simultaneously. A lightweight algorithm is used to analyze the test data and obtain the compensation parameters. This algorithm stores only the most relevant data, reducing memory and computing power requirements. This allows it to be run in real time on a low-cost microcontroller during testing to obtain compensation parameters immediately. This method is aimed at mass factory calibration, where individual calibration with traditional methods may not be an adequate option. The proposed method has been compared with a traditional calibration using a six tests in orthogonal directions and a thermal chamber with a relative error difference of 0.3%. Full article
(This article belongs to the Special Issue MEMS Mechanical Sensing Device)
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14 pages, 7369 KiB  
Article
Design and Optimization of a Novel MEMS Tuning Fork Gyroscope Microstructure
by Chuanguo Xiong, Pengjun Zeng, Weishan Lv, Fengming Lu, Ming Zhang, Yuhua Huang and Fulong Zhu
Micromachines 2022, 13(2), 172; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13020172 - 24 Jan 2022
Cited by 2 | Viewed by 2511
Abstract
This paper presents the design and optimization of a novel MEMS tuning fork gyroscope microstructure. In order to improve the mechanical sensitivity of the gyroscope, much research has been carried out in areas such as mode matching, improving the quality factor, etc. This [...] Read more.
This paper presents the design and optimization of a novel MEMS tuning fork gyroscope microstructure. In order to improve the mechanical sensitivity of the gyroscope, much research has been carried out in areas such as mode matching, improving the quality factor, etc. This paper focuses on the analysis of mode shape, and effectively optimizes the decoupling structure and size of the gyroscope. In terms of structural design, the vibration performance of the proposed structure was compared with other typical structures. It was found that slotting in the middle of the base improved the transmission efficiency of Coriolis vibration, and opening arc slots between the tines reduced the working modal order and frequency. In terms of size optimization, the Taguchi method was used to optimize the relevant feature sizes of the gyroscope. Compared with the initial structure, the transmission efficiency of Coriolis vibration of the optimized gyroscope was improved by about 18%, and the working modal frequency was reduced by about 2.7 kHz. Improvement of these two indicators will further improve the mechanical sensitivity of the gyroscope. Full article
(This article belongs to the Special Issue MEMS Mechanical Sensing Device)
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