Micromachined Devices for Microwave Signal Processing

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 678

Special Issue Editors


E-Mail Website
Guest Editor
CNR-IMM Roma, Via del Fosso del Cavaliere 100, 00133 Roma, Italy
Interests: metamaterials for high-frequency applications; microwave components with a focus on RF MEMS and NEMS; microwave and millimeter wave components for space and security; scanning microwave microscopy for magnetic, semiconducting, and dielectric materials
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
CNR-IMM Roma, Via del Fosso del Cavaliere 100, 00133 Roma, Italy
Interests: microwave measurements applied to cultural heritage; microwave tomography; RF MEMS

Special Issue Information

Dear Colleagues, 

Microsystem technology designed for high-frequency applications has become a well-established research domain focusing on many microwave-to-millimeter wave devices and subsystems. Applications encompass ground and space architectures for signal routing, including (i) phase shifters in RADAR systems, radio-link communications, satellite reconfiguration, and redundancy logic by RF MEMS switches; (ii) membrane-supported sensing; and (iii) material science probes.

Over the past two decades, micromachining techniques have contributed to technological solutions for manufacturing different types of high-frequency devices based on membrane-supported filters and antennas, RF MEMS switches, probes for material science, and micromachined magnetically coupled structures, just to mention a few applications.

The main advantage of using micromachining is that it is intended to produce structures suitable for high-performance microwave-to-millimeter wave signal processing. Physical (such as RIE, plasma, or LASER) and chemical (such as KOH or TMAH) etching can shape 3D structures and remove sacrificial layers. These techniques are applied in manufacturing devices hosted on substrates typically used in microelectronic applications such as silicon, GaAs, GaN, alumina, and more.

Open questions for all these applications are the compatibility between the etching techniques and the materials used, the lifetime of RF MEMS switches, or potential harsh environment utilization.

For this Special Issue, we welcome research papers, communications, and review article contributions describing the state-of-the-art design, technology, and applications for high-frequency microsystems developed by micromachining techniques.

Dr. Romolo Marcelli
Dr. Emanuela Proietti
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micromachining
  • RF MEMS
  • etching techniques
  • membrane-supported devices
  • integrated coupled structures
  • AlScN high-frequency resonators, filters, and delay lines

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

22 pages, 6005 KiB  
Article
Coupled Micromachined Magnetic Resonators for Microwave Signal Processing
by Romolo Marcelli, Andrea Lucibello, Emanuela Proietti and Takuro Koike
Micromachines 2024, 15(2), 259; https://0-doi-org.brum.beds.ac.uk/10.3390/mi15020259 - 10 Feb 2024
Viewed by 584
Abstract
In this paper, the theory, micromachining technology, and experimental results of the coupling of integrated magnetic film-based resonators for microwave signal filtering are presented. This is an extended contribution to the field of magnetostatic wave coupled resonators, including details about the technological results, [...] Read more.
In this paper, the theory, micromachining technology, and experimental results of the coupling of integrated magnetic film-based resonators for microwave signal filtering are presented. This is an extended contribution to the field of magnetostatic wave coupled resonators, including details about the technological results, circuit theory, and perspective applications for tunable integrated coupled magnetic resonators. An analytical approach using the magnetostatic wave approximation is used to derive the coupling coefficient between adjacent resonators coupled by the electromagnetic field decaying outside the resonators. Then, micromachining employing hot phosphoric acid etching is presented to manufacture integrated coupled resonators. Finally, circuit modeling and experimental results obtained using the ferromagnetic resonance technique are discussed. Full article
(This article belongs to the Special Issue Micromachined Devices for Microwave Signal Processing)
Show Figures

Figure 1

Back to TopTop