The Synthesis of Copper Nanoparticles for Printed Electronic Materials Using Liquid Phase Reduction Method

This text discusses the synthesis of copper nanoparticles via a liquid phase reduction method, using ascorbic acid as a reducing agent and CuSO₄·5H₂O as the copper source. The synthesized copper nanoparticles are small in size, uniformly distributed, are mostly between 100–200 nm with clear boundaries between particles, and exhibit excellent dispersibility, making them suitable for metal conductive inks. 1. The copper nanoparticles are analyzed for good antioxidation properties, because their surface is coated with PVP and ascorbic acid. This organic layer somewhat isolates the particle surface from contact with air, preventing oxidation, and accounts for about 9% of the total weight. 2. When the prepared copper nanoparticles are spread on a polyimide substrate and sintered at 250 °C for 120 min, the resistivity can be as low as 23.5 μΩ·cm, and at 350 °C for 30 min, the resistivity is only three times that of bulk copper. 3. The prepared conductive ink, printed on a polyimide substrate using a direct writing tool, shows good flexibility before and after sintering. After sintering at 300 °C for 30 min and connecting the pattern to a circuit with a diode lamp, the diode lamp is successfully lit. 4. This method produces copper nanoparticles with small size, good dispersion, and antioxidation capabilities, and the conductive ink prepared from them demonstrates good conductivity after sintering.