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Journal: Appl. Sci., 2021
Volume: 11
Number: 8424

Article: Combined Use of 3D and HSI for the Classification of Printed Circuit Board Components
Authors: by Songuel Polat, Alain Tremeau and Frank Boochs
Link: https://0-www-mdpi-com.brum.beds.ac.uk/2076-3417/11/18/8424

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