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Journal: Appl. Sci., 2019
Volume: 9
Number: 1962

Article: Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric
Authors: by Jiangbo Luo, Yongpeng Wu, Yunna Sun, Guilian Wang, Yanmei Liu, Xiaolin Zhao and Guifu Ding
Link: https://0-www-mdpi-com.brum.beds.ac.uk/2076-3417/9/9/1962

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