Multiferroic Materials 2021

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".

Deadline for manuscript submissions: closed (31 August 2021) | Viewed by 295
Related Special Issue: Multiferroic Materials 2021

Special Issue Editor


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Guest Editor
Experimental Mechanics Laboratory, Mechanical Engineering Department, San Diego State University, San Diego, CA 92182, USA
Interests: impact mitigation; elastomeric foams; mechanics of polymers; fuse filament fabrication; stereolithography; experimental mechanics; composite materials; smart materials
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Special Issue Information

Dear Colleagues,

In recent years, research in multiferroic materials has resulted in significant advances and translational applications by elucidating the fundamental underpinnings of coupling using analytical, computational, and experimental approaches. Multiferroic materials may exhibit intrinsic or extrinsic coupling between strain, electrical, and magnetic energies due to complex interactions between different ferroic-order parameters. Nonetheless, new advances continue to be reported in the synthesis, characterization, modeling, optimization, and reliability of multiferroic materials and devices based on these materials. The excitement about multiferroic materials continues to invigorate basic and applied research.

This Special Issue entitled "Multiferroic Materials”, seeks to attract a trans-disciplinary readership by covering the recent progress in:

  • multiscale modeling and simulation;
  • multiscale fabrication and characterization;
  • synthesis of novel intrinsic and composite materials;
  • novel sensing, actuation, and communication devices;
  • new coupling mechanisms, including electric, magnetic, mechanical, optical, and thermal;
  • in situ, multi-field characterization; and
  • coupling and switching dynamics.

You may choose our Joint Special Issue in Magnetochemistry.

Dr. George Youssef
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multiferroic spin-transfer torque junctions
  • multiferroic charge-transfer materials
  • multiferroic strain-mediation materials
  • intrinsic multiferroic materials
  • composite multiferroic materials
  • multiscale modeling (ab initio, molecular dynamic, micromagentics, finite element, effective media, etc.)
  • converse- and direct-coupling paradigms
  • multiscale characterization
  • reliability and assessment of multiferroic-based devices
  • applications: sensing, actuation, communication, energy harvesting, wireless energy transfer, etc.

Published Papers

There is no accepted submissions to this special issue at this moment.
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