Microwave Integrated Core-Chips

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: closed (30 June 2022) | Viewed by 2559

Special Issue Editors


E-Mail Website
Guest Editor
Department of Electronics and Telecommunications, Politecnico di Torino, 10129 Torino, Italy
Interests: microwave integrated circuits; microwave power amplifiers; MMICs; stability analysis; microwave device modelling; microwave measurements; satellite radio
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Dept. Electronics Engineering, Università di Roma Tor Vergata, 00133 Roma RM, Italy
Interests: low noise amplifiers; RF amplitude control circuits; MMIC mixers; MMIC oscillators; frequency multipliers; microwave switches

E-Mail Website
Guest Editor
Centre for High Frequency Engineering, Cardiff University, Cardiff CF10 3AT, UK
Interests: high-frequency electronics design and characterization; MMIC power amplifiers; digital predistortion; microwave measurements

Special Issue Information

Dear Colleagues,

Active electronically scanned antennas (AESAs) represent a technological breakthrough in terms of improved performance, reconfigurability and wideband capabilities, but have also improved reliability and ease of installation and reduced cost and weight, finding application in mobile communication (5G), space communication and radar systems.

AESA systems include a huge number of radiating elements, each one equipped with its own transmit/receive module (TRM), which must therefore be extremely compact and have low weight, low cost and high repeatability. This can be accomplished by reducing the number of MMICs in the TRM and hence by increasing their capabilities to perform different functions.

Core chips (CCs), also called multi-function chips (MFCs), are highly integrated MMICs that perform all the core functions of a TRM, and thus they allow the combination of phased array controls, switches and amplifiers on the same chip, possibly with embedded digital controls and interfaces.

The main challenge in developing compact and efficient core chips is combining a high level of integration with high yield and repeatability and, possibly, low cost.

Moreover, enabling digital/RF integration is also challenging from a technological standpoint, requiring MMIC processes capable of offering simultaneously high cut-off frequencies and thus good RF performance (up to Ka-band) and digital features, such as complementary transistors with efficient switching behavior. At present, depending on the most demanding aspect of a specific core chip, the preferred technology can be selected, and both Si-based and compound semiconductor technologies are still in the race.

This Special Issue will include technical papers covering all the various aspects of core-chip development, from enabling technologies to specific sub-components demonstrators and complete CC modules.

Dr. Chiara Ramella
Dr. Roberto Quaglia
Dr. Patrick Ettore Longhi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • core chip
  • multi-function chip
  • phased array controls
  • integrated switches
  • RF-CMOS
  • GaAs
  • GaN
  • phase shifters
  • variable attenuators
  • variable gain amplifiers

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Review

16 pages, 338 KiB  
Review
GaAs-Based Serial-Input-Parallel-Output Interfaces for Microwave Core-Chips
by Chiara Ramella, Motahhareh Estebsari, Abbas Nasri and Marco Pirola
Electronics 2021, 10(23), 3029; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics10233029 - 04 Dec 2021
Cited by 1 | Viewed by 1866
Abstract
Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly other elements, each to be controlled by external [...] Read more.
Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly other elements, each to be controlled by external digital signals. Given the large number of control lines to be integrated in a core-chip, the embedding of a serial to parallel interface is indispensable. Digital design in compound semiconductor technology is still rather challenging due to the absence of complementary devices and the availability of a limited number of metallization layers. Moreover, in large arrays, high chip yield and repeatability are required. This paper discusses and compares challenges and solutions for the key sub-circuits of GaAs serial to parallel converters for core-chip applications, reviewing the pros and cons of the different implementations proposed in the literature. Full article
(This article belongs to the Special Issue Microwave Integrated Core-Chips)
Show Figures

Figure 1

Back to TopTop