Advances on Electronics for Harsh Environments

A special issue of Electronics (ISSN 2079-9292).

Deadline for manuscript submissions: 15 October 2024 | Viewed by 1776

Special Issue Editors


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Guest Editor
Department of Information Engineering, University of Pisa, 56122 Pisa, Italy
Interests: microelectronic design of analog and mixed-signal integrated circuits; ultra-low voltage and ultra-low power circuits; sensor data acquisition systems; wireless power transfer systems

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Guest Editor
Department of Information Engineering, University of Pisa, 56122 Pisa, Italy
Interests: quantum transport; materials/device engineering for electronics; design of analog and mixed-signal integrated circuits for artificial intelligence; analog circuit design; systems for the Internet of Things
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Special Issue Information

Dear Colleagues,

The development of new technologies and new design solutions enabled the presence of electronic systems, even in areas characterized by extreme working conditions, opening the way to unexplored fields of applications. By “harsh environment”, we mean the set of ambient conditions far from the standard ones usually considered during the design of conventional electronic systems, in terms of temperature, pressure, ionizing radiation, electromagnetic interference and radiation, chemical contamination, mechanical stress, moisture, etc. Space electronics represent a solid example where the designers need to implement different solutions at physical, circuit, architecture, and software levels to preserve performance in the presence of radiations and high temperature. Countless applications also exist on Earth where electronics need to face harsh environments. By considering possible extreme temperature ranges (well beyond commercial, industrial, or military ranges), we can sweep from few tens of mK, as for cryogenic electronics for quantum computing and physics experiments, to very high temperature electronics for industrial applications, drilling rigs, and electric engines. The human body represents another environment where safety issues dictate severe limitations for power dissipation and electromagnetic emissions of implantable and wearable medical devices. In some of these contexts, research of new technologies based on alternative materials represents the only viable way to match the strict requirements dictated by extreme working conditions. However, CMOS electronic systems capable of working beyond the certified ranges of the commercial technology processes remain attractive for large-scale integration. Within the aim of this Special Issue, the topics of interest include, but are not limited to, the following:

  • Wide-bandgap semiconductors and two-dimensional materials for electronic devices;
  • Digital and analog techniques to improve the robustness and the lifetime of electronic systems;
  • Smart-sensing systems for the monitoring of extreme environmental conditions;
  • Power management systems capable of working in extreme conditions;
  • RF communications in harsh environments.

Dr. Alessandro Catania
Prof. Dr. Giuseppe Iannaccone
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • device modeling and characterization
  • emerging technologies
  • cryogenics electronics
  • high-temperature electronics
  • implantable and wearable devices
  • electronics for space explorations
  • radiation-hard systems, circuits, and technologies
  • physical and chemical sensing systems for extreme environments

Published Papers (2 papers)

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Research

14 pages, 3958 KiB  
Article
Load Modulation Feedback in Adaptive Matching Networks for Low-Coupling Wireless Power Transfer Systems
by Michele Bertozzi, Alessandro Catania, Gabriele Bandini, Sebastiano Strangio and Giuseppe Iannaccone
Electronics 2023, 12(22), 4619; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics12224619 - 12 Nov 2023
Viewed by 705
Abstract
This paper explores the use of load modulation feedback (LMF) in adaptive matching networks (MN) for low-coupling inductive wireless power transfer systems, with an emphasis on its use in implantable medical devices. After deriving the handy expressions of link efficiency and modulation depth [...] Read more.
This paper explores the use of load modulation feedback (LMF) in adaptive matching networks (MN) for low-coupling inductive wireless power transfer systems, with an emphasis on its use in implantable medical devices. After deriving the handy expressions of link efficiency and modulation depth in the case of LMF in the case of loose coupling, a brief overview of the most common capacitive resonance networks is presented. In particular, the MN employing two capacitors in Series–Parallel and in Parallel–Series configurations allow adaptivity with a wide range of load conditions. Then, the authors describe an effective design procedure of an adaptive matching network with LMF for an inductive wireless power transfer system, exploring the trade-off between power efficiency and modulation depth. Analytical and electrical simulations show that the proposed simple modulation strategy can successfully achieve high power transfer efficiency while maintaining steady back telemetry under varying loading conditions. Full article
(This article belongs to the Special Issue Advances on Electronics for Harsh Environments)
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15 pages, 1790 KiB  
Article
High-Density Pixel Imaging Sensor Readout Electronics for Space Applications: A Design Overview
by Massimo Minuti, Carmelo Sgrò, Luca Baldini, Ronaldo Bellazzini, Alessandro Brez, Simone Castellano, Niccolo Di Lalla, Luca Latronico, Simone Maldera, Alberto Manfreda, Melissa Pesce-Rollins, Gloria Spandre, Mattia Barbanera, Saverio Citraro, Leonardo Lucchesi, Carlo Magazzù, Guido Magazzù, Paolo Mereu, Federico Mosti, Alessio Nuti, Leonardo Orsini, Hikmat Nasimi, Michele Pinchera, Davide Zanetti, Fabio Borotto, Marco Ceccanti, Marco Marengo, Alessandro Profeti, Ciro Caporale, Claudia Cardelli, Marcello Tardiola, Fabrizio Amici, Primo Attinà, Matteo Bachetti, Daniele Brienza, Mauro Centrone, Enrico Costa, Ettore Del Monte, Sergio Di Cosimo, Alessandro Di Marco, Giuseppe Di Persio, Yuri Evangelista, Sergio Fabiani, Riccardo Ferrazzoli, Fabio La Monaca, Carlo Lefevre, Pasqualino Loffredo, Alfredo Morbidini, Fabio Muleri, Matteo Perri, Raffaele Piazzolla, Maura Pilia, John Rankin, Ajay Ratheesh, Alda Rubini, Francesco Santoli, Emanuele Scalise, Paolo Soffitta, Antonino Tobia, Alessio Trois, Fei Xie, Rita Carpentiero, Marco Castronuovo, Elisabetta Cavazzuti, Fabio D’Amico, Immacolata Donnarumma, Barbara Negri, Simonetta Puccetti, Luca Cavalli, Elisa D’Alba, Paolo Lorenzi, Elio Mangraviti, Paolo Sarra, Andrea Sciortino, Marco Vimercati, Stefano Pieraccini and Francesco Zanettiadd Show full author list remove Hide full author list
Electronics 2023, 12(17), 3589; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics12173589 - 25 Aug 2023
Viewed by 735
Abstract
With the specialization of VLSI ASICs for front-end signal processing electronics, the customization of the control back-end electronics (BEE) has become critical to fully deploy the ASIC performance. In the context of space operations, with typical constraints on power and reliability, the design [...] Read more.
With the specialization of VLSI ASICs for front-end signal processing electronics, the customization of the control back-end electronics (BEE) has become critical to fully deploy the ASIC performance. In the context of space operations, with typical constraints on power and reliability, the design and qualification of such integrated systems present significant challenges. In this paper, we review the design and performance of the BEE systems after two years of operations in low Earth orbit (LEO); these systems read out the custom ASICs inside the gas pixel detectors, which are located at the heart of the imaging X-ray polarimetry explorer (IXPE), a NASA-ASI small explorer mission designed to measure X-ray polarization in the 2–8 keV energy range. Full article
(This article belongs to the Special Issue Advances on Electronics for Harsh Environments)
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