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Electronics
Special Issues
Reliability and Fault Tolerance Techniques in Emerging Technologies
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Reliability and Fault Tolerance Techniques in Emerging Technologies

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: closed (30 November 2021) | Viewed by 3675

Special Issue Editors

Prof. Dr. Matteo Sonza Reorda

E-Mail Website
Guest Editor
Department of Control and Computer Engineering, Politecnico di Torino, 10129 Torino, Italy
Interests: test of ICs; fault tolerance of digital circuits and systems
Dr. Sarah Azimi

E-Mail Website
Guest Editor
Department of Control and Computer Engineering, Politecnico di Torino, 10129 Torino, Italy
Interests: fault Tolerance; 3D ICs design

Special Issue Information

Dear Colleagues,

The focus of this Special Issue is on the advancements in reliability and fault tolerance techniques for emerging semiconductor technologies, including three-dimensional technologies (such as 2.5D/3D Integrated Circuits), nanoscale FinFET devices, innovative memories (such as PCRAM, STTMRAM, RRAM), introducing state-of-the-art investigations on the methods and techniques as well as modern implementation technologies enabling an effective and efficient development of highly reliable systems and designs.

The topics of interest include but are not limited to all the following topics applied to emerging semiconductor technologies:

  • Design for Reliability
  • Design for Single Event Effect Hardening
  • Single Event Effect Modeling, Analysis, and Mitigation
  • Modeling and Analysis of Radiation Effect
  • Hardening Techniques for Transient Errors
  • CAD Tools for 3D Technologies
  • Design and Test for 2.5D/3D ICs
  • Design and Test for 3D memories
  • Design and Test for Emerging Memory Technologies

Prof. Dr. Matteo Sonza Reorda
Dr. Sarah Azimi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (1 paper)

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Research

13 pages, 2168 KiB  
Article
Analysis of Single Event Effects on Embedded Processor
by Sarah Azimi, Corrado De Sio, Daniele Rizzieri and Luca Sterpone
Electronics 2021, 10(24), 3160; https://0-doi-org.brum.beds.ac.uk/10.3390/electronics10243160 - 18 Dec 2021
Cited by 9 | Viewed by 3039
Abstract
The continuous scaling of electronic components has led to the development of high-performance microprocessors which are even suitable for safety-critical applications where radiation-induced errors, such as single event effects (SEEs), are one of the most important reliability issues. This work focuses on the [...] Read more.
The continuous scaling of electronic components has led to the development of high-performance microprocessors which are even suitable for safety-critical applications where radiation-induced errors, such as single event effects (SEEs), are one of the most important reliability issues. This work focuses on the development of a fault injection environment capable of analyzing the impact of errors on the functionality of an ARM Cortex-A9 microprocessor embedded within a Zynq-7000 AP-SoC, considering different fault models affecting both the system memory and register resources of the embedded processor. We developed a novel Python-based fault injection platform for the emulation of radiation-induced faults within the AP-SoC hardware resources during the execution of software applications. The fault injection approach is not intrusive, and it does not require modifying the software application under evaluation. The experimental analyses have been performed on a subset of the MiBench benchmark software suite. Fault injection results demonstrate the capability of the developed method and the possibility of evaluating various sets of fault models. Full article
(This article belongs to the Special Issue Reliability and Fault Tolerance Techniques in Emerging Technologies)
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