Thermally Conductive Composites: Recent Developments and Practical Aspects

Dear Colleagues,

Due to the rapid progression of integration techniques, efficient heat dissipation has become a main issue with increasing the reliability and service life of high-power electronic devices, and thus, superior thermal management materials are in high demand. In recent years, advanced filler designs and interface engineering have substantially improved the thermal properties of thermally conductive composites, which are core thermal management materials.

This Special Issue will summarize the recent developments and practical aspects of thermally conductive composites, including, but not limited to, metal matrix composites, ceramic matrix composites, and polymer matrix composites. Articles addressing thermally conductive fillers, interface microstructure designs, interfacial thermal conductance, theoretical calculations, and so on, are all welcome.

Prof. Dr. Hailong Zhang
Dr. Xiaoliang Zeng
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• thermally conductive composites
• thermal management materials
• metal matrix composites
• polymer matrix composites
• ceramic matrix composites
• thermal conductivity
• interfacial thermal conductane
• interfacial thermal resistance
• interface
• filler