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Silicon Carbide: From Fundamentals to Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Composites".

Deadline for manuscript submissions: closed (31 December 2020) | Viewed by 21085

Special Issue Editor


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Guest Editor
Institute for Problems in Mechanical Engineering, Russian Academy of Sciences, St. Petersburg, Russia
Interests: materials science and engineering solid state physics; phase transitions; physics semiconductors; thin films growth; growth of wide bandgap semiconductors (SiC, GaN, AlN, BN, et al.) and nanostructures; crystal growth; growth of nanowires
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Special Issue Information

Dear Colleagues,

Silicon carbide is the only binary compound of silicon and carbon that exists in the solid phase under normal conditions. As early as 1824, Jöns Jakob Berzelius first suggested that a chemical bond might exist between silicon and carbon. Silicon carbide is rare in the уarth environment, but it is widespread in the universe and often found in meteorites. The first SiC crystals of extraterrestrial origin were discovered by Henry Moissan in 1905 during the examination of meteorites in the Devil's Canyon in the Arizona desert. In his honor, the mineral was called moissanite. Producing artificial silicon carbide was first patented in 1891 by Edward Acheson. Ironically, the active use of silicon carbide in microelectronics began only in recent years, despite the fact that silicon carbide is one of the first materials of solid-state electronics. As early as 1907, H. Round observed luminescence when an electric current passed through a SiC crystal. In 1923–1940, Oleg Losev investigated the electroluminescence of silicon carbide in more detail. Losev also found a relation between current rectification and electroluminescence in SiC. Thus, the two most important phenomena for semiconductor electronics—electroluminescence and the rectifying properties of p–n structures—were first discovered in SiC crystals. SiC crystals have a large bandgap in comparison with Si and GaAs, which allows a significant expansion of the operating temperatures of electronic devices (theoretically up to ~1000°C). Due to the larger (by order of magnitude) breakdown field of SiC than that of silicon, the doping level of a SiC diode can be two orders of magnitude higher than that of a silicon diode at the same breakdown voltage. Silicon carbide is a radiation-resistant material. The high thermal conductivity of SiC (at the level of thermal conductivity of copper) greatly simplifies the problem of heat removal from devices. This property, combined with high permissible operating temperatures and high saturation rates of carriers (high saturation currents of field-effect transistors), makes SiC devices very promising for use in power electronics. In addition, the high Debye temperature, which determines the temperature at which phonons arise, indicates the high thermal stability of SiC. Thus, silicon carbide surpasses classical semiconductor materials, Si and GaAs, in almost all important criteria.

The topic of this issue covers a wide range of questions devoted to the study of fundamental and applied aspects of the nucleation and growth mechanisms of crystals and thin films of silicon carbide, to the formation of growth defects, and transport mechanisms of charge carriers. Particular attention will be paid to the growth of silicon carbide layers on silicon, since the combination of these two materials allows integration of silicon carbide, as well as films of wide-bandgap materials (such as GaN, AlN, Ga2O3) grown on its surface, with silicon—the main material of modern micro- and optoelectronics.

Particular attention will also be paid to the growth processes and properties of crystals, thin films, nanocrystals, and nanostructures of wide-bandgap semiconductors (such as GaN, AlN, and Ga2O3) grown on SiC. These materials are especially relevant due to the wide range of applications of semiconductor structures based on them that are relevant in the world industry.

It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are all welcome.

Prof. Sergey Kukushkin
Guest Editor

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Keywords

  • silicon carbide
  • crystal growth
  • silicon carbide on silicon
  • thin film growth
  • phase transition
  • wide bandgap semiconductors
  • nanostructures
  • growth of nanowires

Published Papers (8 papers)

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Editorial

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4 pages, 168 KiB  
Editorial
Special Issue: Silicon Carbide: From Fundamentals to Applications
by Sergey Kukushkin
Materials 2021, 14(5), 1081; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14051081 - 26 Feb 2021
Cited by 5 | Viewed by 1770
Abstract
Most of the wide variety of electronic devices today are silicon-based [...] Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)

Research

Jump to: Editorial

10 pages, 2162 KiB  
Article
4H-SiC Drift Step Recovery Diode with Super Junction for Hard Recovery
by Xiaoxue Yan, Lin Liang, Xinyuan Huang, Heqing Zhong and Zewei Yang
Materials 2021, 14(3), 684; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14030684 - 2 Feb 2021
Cited by 4 | Viewed by 2735
Abstract
Silicon carbide (SiC) drift step recovery diode (DSRD) is a kind of opening-type pulsed power device with wide bandgap material. The super junction (SJ) structure is introduced in the SiC DSRD for the first time in this paper, in order to increase the [...] Read more.
Silicon carbide (SiC) drift step recovery diode (DSRD) is a kind of opening-type pulsed power device with wide bandgap material. The super junction (SJ) structure is introduced in the SiC DSRD for the first time in this paper, in order to increase the hardness of the recovery process, and improve the blocking capability at the same time. The device model of the SJ SiC DSRD is established and its breakdown principle is verified. The effects of various structure parameters including the concentration, the thickness, and the width of the SJ layer on the electrical characteristics of the SJ SiC DSRD are discussed. The characteristics of the SJ SiC DSRD and the conventional SiC DSRD are compared. The results show that the breakdown voltage of the SJ SiC DSRD is 28% higher than that of the conventional SiC DSRD, and the dv/dt output by the circuit based on SJ SiC DSRD is 31% higher than that of conventional SiC DSRD. It is verified that the SJ SiC DSRD can achieve higher voltage, higher cut-off current and harder recovery characteristics than the conventional SiC DSRD, so as to output a higher dv/dt voltage on the load. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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23 pages, 7625 KiB  
Article
Graphene on SiC Substrate as Biosensor: Theoretical Background, Preparation, and Characterization
by Alexander A. Lebedev, Sergey Yu Davydov, Ilya A. Eliseyev, Alexander D. Roenkov, Oleg Avdeev, Sergey P. Lebedev, Yurii Makarov, Mikhail Puzyk, Sergey Klotchenko and Alexander S. Usikov
Materials 2021, 14(3), 590; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14030590 - 27 Jan 2021
Cited by 17 | Viewed by 2474
Abstract
This work is devoted to the development and optimization of the parameters of graphene-based sensors. The graphene films used in the present study were grown on semi-insulating 6H-SiC substrates by thermal decomposition of SiC at the temperature of ~1700 °C. The results of [...] Read more.
This work is devoted to the development and optimization of the parameters of graphene-based sensors. The graphene films used in the present study were grown on semi-insulating 6H-SiC substrates by thermal decomposition of SiC at the temperature of ~1700 °C. The results of measurements by Auger and Raman spectroscopies confirmed the presence of single-layer graphene on the silicon carbide surface. Model approach to the theory of adsorption on epitaxial graphene is presented. It is demonstrated that the Green-function method in conjunction with the simple substrate models permit one to obtain analytical results for the charge transfer between adsorbed molecules and substrate. The sensor structure was formed on the graphene film by laser. Initially, a simpler gas sensor was made. The sensors developed in this study demonstrated sensitivity to the NO2 concentration at the level of 1–0.01 ppb. The results obtained in the course of development and the results of testing of the graphene-based sensor for detection of protein molecules are also presented. The biosensor was fabricated by the technology previously developed for the gas sensor. The working capacity of the biosensor was tested with an immunochemical system constituted by fluorescein and monoclonal antibodies (mAbs) binding this dye. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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13 pages, 25694 KiB  
Article
Detector Response to D-D Neutrons and Stability Measurements with 4H Silicon Carbide Detectors
by Matteo Hakeem Kushoro, Marica Rebai, Marco Tardocchi, Carmen Altana, Carlo Cazzaniga, Eliana De Marchi, Francesco La Via, Laura Meda, Alessandro Meli, Miriam Parisi, Enrico Perelli Cippo, Mario Pillon, Antonio Trotta, Salvo Tudisco and Giuseppe Gorini
Materials 2021, 14(3), 568; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14030568 - 26 Jan 2021
Cited by 5 | Viewed by 2348
Abstract
The use of wide-band-gap solid-state neutron detectors is expanding in environments where a compact size and high radiation hardness are needed, such as spallation neutron sources and next-generation fusion machines. Silicon carbide is a very promising material for use as a neutron detector [...] Read more.
The use of wide-band-gap solid-state neutron detectors is expanding in environments where a compact size and high radiation hardness are needed, such as spallation neutron sources and next-generation fusion machines. Silicon carbide is a very promising material for use as a neutron detector in these fields because of its high resistance to radiation, fast response time, stability and good energy resolution. In this paper, measurements were performed with neutrons from the ISIS spallation source with two different silicon carbide detectors together with stability measurements performed in a laboratory under alpha-particle irradiation for one week. Some consideration to the impact of the casing of the detector on the detector’s counting rate is given. In addition, the detector response to Deuterium-Deuterium (D-D) fusion neutrons is described by comparing neutron measurements at the Frascati Neutron Generator with a GEANT4 simulation. The good stability measurements and the assessment of the detector response function indicate that such a detector can be used as both a neutron counter and spectrometer for 2–4 MeV neutrons. Furthermore, the absence of polarization effects during neutron and alpha irradiation makes silicon carbide an interesting alternative to diamond detectors for fast neutron detection. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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12 pages, 3568 KiB  
Article
Anomalous Properties of the Dislocation-Free Interface between Si(111) Substrate and 3C-SiC(111) Epitaxial Layer
by Sergey A. Kukushkin and Andrey V. Osipov
Materials 2021, 14(1), 78; https://0-doi-org.brum.beds.ac.uk/10.3390/ma14010078 - 26 Dec 2020
Cited by 13 | Viewed by 1790
Abstract
Thin films of single-crystal silicon carbide of cubic polytype with a thickness of 40–100 nm, which were grown from the silicon substrate material by the method of coordinated substitution of atoms by a chemical reaction of silicon with carbon monoxide CO gas, have [...] Read more.
Thin films of single-crystal silicon carbide of cubic polytype with a thickness of 40–100 nm, which were grown from the silicon substrate material by the method of coordinated substitution of atoms by a chemical reaction of silicon with carbon monoxide CO gas, have been studied by spectral ellipsometry in the photon energy range of 0.5–9.3 eV. It has been found that a thin intermediate layer with the dielectric constant corresponding to a semimetal is formed at the 3C-SiC(111)/Si(111) interface. The properties of this interface corresponding to the minimum energy have been calculated using quantum chemistry methods. It has turned out that silicon atoms from the substrate are attracted to the interface located on the side of the silicon carbide (SiC) film. The symmetry group of the entire system corresponds to P3m1. The calculations have shown that Si atoms in silicon carbide at the interface, which are the most distant from the Si atoms of the substrate and do not form a chemical bond with them (there are only 12% of them), provide a sharp peak in the density of electronic states near the Fermi energy. As a result, the interface acquires semimetal properties that fully correspond to the ellipsometry data. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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12 pages, 7179 KiB  
Article
Adjusting the Morphology and Properties of SiC Nanowires by Catalyst Control
by Chuchu Guo, Laifei Cheng, Fang Ye and Qing Zhang
Materials 2020, 13(22), 5179; https://0-doi-org.brum.beds.ac.uk/10.3390/ma13225179 - 17 Nov 2020
Cited by 10 | Viewed by 2308
Abstract
We report on the growth of SiC nanowires on a single crystal Si substrate by pyrolysis of polycarbosilane and using two catalyst (Al2O3 and Ni) films with different thickness (2, 4, and 6 nm). The catalyst films were deposited on [...] Read more.
We report on the growth of SiC nanowires on a single crystal Si substrate by pyrolysis of polycarbosilane and using two catalyst (Al2O3 and Ni) films with different thickness (2, 4, and 6 nm). The catalyst films were deposited on the Si substrate, and the SiC nanowires were grown according to two mechanisms, i.e., the oxide-assisted growth mechanism and vapor- liquid-solid mechanism. As a result, pearl-chain-like SiC nanowires and straight SiC nanowires were obtained. The prepared nanowires exhibited excellent photoluminescence properties, emission spectra displaying two emission peaks at 395 and 465 nm, and have good thermal stability below 1000 °C. The experimental results revealed the importance of the catalyst in controlling the morphology and properties of SiC nanowires. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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12 pages, 5135 KiB  
Article
Effect of Carbon Addition and Mixture Method on the Microstructure and Mechanical Properties of Silicon Carbide
by Zeynep Aygüzer Yaşar and Richard A. Haber
Materials 2020, 13(17), 3768; https://0-doi-org.brum.beds.ac.uk/10.3390/ma13173768 - 26 Aug 2020
Cited by 15 | Viewed by 2789
Abstract
High dense (>99% density) SiC ceramics were produced with addition of C and B4C by spark plasma sintering method at 1950 °C under 50 MPa applied pressure for 5 min. To remove the oxygen from the SiC, it was essential to [...] Read more.
High dense (>99% density) SiC ceramics were produced with addition of C and B4C by spark plasma sintering method at 1950 °C under 50 MPa applied pressure for 5 min. To remove the oxygen from the SiC, it was essential to add C. Two different mixture method were used, dry mixing (specktromill) and wet mixing (ball milling). The effect of different levels of carbon additive and mixture method on density, microstructure, elastic modulus, polytype of SiC, Vickers hardness, and fracture toughness were examined. Precisely, 1.5 wt.% C addition was sufficient to remove oxide layer from SiC and improve the properties of dense SiC ceramics. The highest hardness and elastic modulus values were 27.96 and 450 GPa, respectively. Results showed that the 4H polytype caused large elongated grains, while the 6H polytype caused small coaxial grains. It has been observed that it was important to remove oxygen to achieve high density and improve properties of SiC. Other key factor was to include sufficient amount of carbon to remove oxide layer. The results showed that excess carbon prevented to achieve high density with high elastic modulus and hardness. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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19 pages, 5207 KiB  
Article
A Comparative Study of Silicon Carbide Merged PiN Schottky Diodes with Electrical-Thermal Coupled Considerations
by Jiupeng Wu, Na Ren, Qing Guo and Kuang Sheng
Materials 2020, 13(11), 2669; https://0-doi-org.brum.beds.ac.uk/10.3390/ma13112669 - 11 Jun 2020
Cited by 11 | Viewed by 3426
Abstract
A comparative study of surge current reliability of 1200 V/5 A 4H-SiC (silicon carbide) MPS (Merged PiN Schottky) diodes with different technologies is presented. The influences of device designs in terms of electrical and thermal aspects on the forward conduction performance and surge [...] Read more.
A comparative study of surge current reliability of 1200 V/5 A 4H-SiC (silicon carbide) MPS (Merged PiN Schottky) diodes with different technologies is presented. The influences of device designs in terms of electrical and thermal aspects on the forward conduction performance and surge current capability were studied. Device forward characteristics were simulated and measured. Standard single-pulse surge current tests and thermal impedance measurements were carried to show their surge capability and thermal design differences. An advanced thermal RC (thermal resistance-capacitance) model, with the consideration of current distribution non-uniformity effects, is proposed to accurately calculate the device junction temperature during surge events. It was found that a thinner substrate and a hexagonal layout design are beneficial to the improvement of the bipolar conduction performance in high current mode, as well as the surge current capability. The thinner substrate design also has advantages on thermal aspects, as it presents the lowest thermal resistance. The calculated failure temperature during the surge tests is consistent with the aluminum melting phenomenon, which is regarded as the failure mechanism. It was demonstrated that, for a SiC MPS diode, higher bipolar conduction performance is conducive to restraining the joule heat, and a lower thermal resistance design is able to accelerate the heat dissipation and limit the junction temperature during surge events. In this way, the MPS diode using a thinner substrate and advanced layout design technology is able to achieve 60% higher surge current density capability compared to the other technologies. Full article
(This article belongs to the Special Issue Silicon Carbide: From Fundamentals to Applications)
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