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Micromachines
Special Issues
Micro/Nano Fabrication in Microdevices and Integrated Systems
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Micro/Nano Fabrication in Microdevices and Integrated Systems

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (30 March 2023) | Viewed by 5222

Special Issue Editor

Prof. Dr. Liang He

E-Mail Website
Guest Editor
School of Mechanical Engineering, Sichuan University, Chengdu 610065, China
Interests: integration of nanomaterial into microsystem; micromachining of carbon-MEMS and integrated microdevice; power-MEMS and on-chip integrated microsystem
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In recent decades, the rapidly advancing development of micro/nano fabrication technology has promoted electronics into a smart era toward ultra-miniaturization, multiple functionalization, and super integration. These kinds of microdevices and integrated systems will impact many application areas, including consumer electronics, industry production, medical research, and diagnostic systems. Accordingly, it is imminent to develop microdevices and microsystems with low cost, unique structures, easy fabrication, high energy conversion efficiency, as well as favorable biological compatibility. Representative examples include but are not limited to power MEMS for on-chip microsystems, microfluidic devices for industrial manufacturing, and wearable sensors for health monitoring. Recent advances in high-performance microdevices and integrated systems ranging from microfabrication techniques and device design to multiple applications have resulted in an increase in their reliability, compatibility, and application potential. Some practical pursuits for applications should be emphasized, such as high-resolution manufacture, rational integration of material and high-energy loading, etc. Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on novel developments in microfabrication, construction, performance, functional integration of microdevices and integrated systems, and their multiple applications.

Prof. Dr. Liang He
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro- and nano-manufacturing
  • microdevices
  • microsystems

Published Papers (3 papers)

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Research

8 pages, 2214 KiB  
Article
Alkaline Ni-Zn Microbattery Based on 3D Hierarchical Porous Ni Microcathode with High-Rate Performance
by Gongchuan You, Zhe Zhu, Yixue Duan, Linfeng Lv, Xiaoqiao Liao, Xin He, Kai Yang, Ruiqi Song, Yi Yang and Liang He
Micromachines 2023, 14(5), 927; https://0-doi-org.brum.beds.ac.uk/10.3390/mi14050927 - 25 Apr 2023
Viewed by 1224
Abstract
Miniaturized energy storage devices with superior performance and compatibility with facile fabrication are highly desired in smart microelectronics. Typical fabrication techniques are generally based on powder printing or active material deposition, which restrict the reaction rate due to the limited optimization of electron [...] Read more.
Miniaturized energy storage devices with superior performance and compatibility with facile fabrication are highly desired in smart microelectronics. Typical fabrication techniques are generally based on powder printing or active material deposition, which restrict the reaction rate due to the limited optimization of electron transport. Herein, we proposed a new strategy for the construction of high-rate Ni-Zn microbatteries based on a 3D hierarchical porous nickel (Ni) microcathode. With sufficient reaction sites from the hierarchical porous structure as well as excellent electrical conductivity from the superficial Ni-based activated layer, this Ni-based microcathode is featured with fast-reaction capability. By virtue of facile electrochemical treatment, the fabricated microcathode realized an excellent rate performance (over 90% capacity retention when the current density increased from 1 to 20 mA cm−2). Furthermore, the assembled Ni-Zn microbattery achieved a rate current of up to 40 mA cm−2 with a capacity retention of 76.9%. Additionally, the high reactivity of the Ni-Zn microbattery is also durable in 2000 cycles. This 3D hierarchical porous Ni microcathode, as well as the activation strategy, provides a facile route for the construction of microcathodes and enriches high-performance output units for integrated microelectronics. Full article
(This article belongs to the Special Issue Micro/Nano Fabrication in Microdevices and Integrated Systems)
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14 pages, 5507 KiB  
Article
Design and Testing of a Novel Nested, Compliant, Constant-Force Mechanism with Millimeter-Scale Strokes
by Xuejiao Qin, Shuaishuai Lu, Pengbo Liu and Peng Yan
Micromachines 2023, 14(2), 480; https://doi.org/10.3390/mi14020480 - 18 Feb 2023
Cited by 2 | Viewed by 1597
Abstract
This paper presents a novel nested, compliant, constant-force mechanism (CFM) that generates millimeter-scale manipulation stroke. The nested structure is utilized to improve the overall compactness of the CFM. A combination strategy of positive and negative stiffness is induced to generate constant force with [...] Read more.
This paper presents a novel nested, compliant, constant-force mechanism (CFM) that generates millimeter-scale manipulation stroke. The nested structure is utilized to improve the overall compactness of the CFM. A combination strategy of positive and negative stiffness is induced to generate constant force with a millimeter-level range. In particular, bi-stable beams are used as the negative stiffness part, and V-shaped beams are selected as the positive stiffness part, and they are constructed into the nested structures. With this, a design concept of the CFM is first proposed. From this, an analytical model of the CFM was developed based on the pseudo-rigid body method (PRBM) and chain beam constraint model (CBCM), which was verified by conducting a simulation study with nonlinear finite-element analysis (FEA). Meanwhile, a parametric study was conducted to investigate the influence of the dominant design variable on the CFM performance. To demonstrate the performance of the CFM, a prototype was fabricated by wire cutting. The experimental results revealed that the proposed CFM owns a good constant-force property. This configuration of CFM provides new ideas for the design of millimeter-scale, constant-force, micro/nano, and hard-surface manipulation systems. Full article
(This article belongs to the Special Issue Micro/Nano Fabrication in Microdevices and Integrated Systems)
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13 pages, 2293 KiB  
Article
Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications
by Zhiqiang Chen and Wenchao Tian
Micromachines 2023, 14(1), 104; https://0-doi-org.brum.beds.ac.uk/10.3390/mi14010104 - 30 Dec 2022
Cited by 2 | Viewed by 1984
Abstract
The development of integrated circuits and packaging technology has led to smaller and smaller transmission line sizes and higher and higher operating frequencies up to nearly 100 GHz. However, the skinning depth of transmission lines due to eddy currents becomes smaller and smaller [...] Read more.
The development of integrated circuits and packaging technology has led to smaller and smaller transmission line sizes and higher and higher operating frequencies up to nearly 100 GHz. However, the skinning depth of transmission lines due to eddy currents becomes smaller and smaller as the operating frequency of coplanar wave guide (CPW) transmission lines becomes higher and higher, while the reduction of device size makes the skinning depth consistent with the surface roughness of the device. In this paper, the concept of modified roughness coefficient was proposed based on the existing correlation factor. The concept of threshold modified roughness coefficient was proposed with a 20 dB reflection coefficient as the threshold value. The effect of surface roughness on transmission line transmission performance at frequencies above 100 GHz up to 1000 GHz was investigated. It was found that when the operating frequency of the signal was greater than the threshold roughness coefficient, the effect of surface roughness on the transmission line reflection coefficient should be considered. The modified roughness coefficient in this paper could quickly determine the effect of surface roughness on transmission line performance at different frequencies. Full article
(This article belongs to the Special Issue Micro/Nano Fabrication in Microdevices and Integrated Systems)
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