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Micromachines
Special Issues
The Lithography Technologies
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The Lithography Technologies

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: closed (20 December 2022) | Viewed by 5230

Special Issue Editors

Dr. Elliot Cheng

E-Mail Website
Guest Editor
Centre for Microscopy and Microanalysis, The University of Queensland, Brisbane, QLD 4072, Australia
Interests: nanofabrication; nanolithography; silicon photonics; nanotransistors
Dr. Anders Barlow

E-Mail Website
Guest Editor
Materials Characterisation and Fabrication Platform, The University of Melbourne, Melbourne, VIC 3010, Australia
Interests: surface chemical analysis; surface physics; ion–surface interactions; nanomaterials; helium ion microscopy; Raman spectroscopy and imaging; X-ray analysis
Special Issues, Collections and Topics in MDPI journals
Dr. Zahra Faraji Rad

E-Mail Website
Assistant Guest Editor
School of Mechanical and Electrical Engineering, University of Southern Queensland, Brisbane, QLD 4300, Australia
Interests: microfluidics; micro/nanotechnology; manufacturing engineering; biomaterials

Special Issue Information

Dear Colleagues,

Lithography is a field of nanotechnology that has been widely used in the microelectronics and microelectro-mechanical systems (MEMS) fabrication. Through many decades of research and development, the lithography technologies have advanced from the traditional contact photolithography to 193nm immersion and extreme ultraviolet lithography in microelectronics. Lithographic technologies have also emerged from the purpose of fabricating masks on a substrate to the direct writing of complicated 2D and 3D structures with lasers, electron beams, focused ion beams, thermal scanning probes, and two-photon polymerization. Furthermore, the fabricated structures could even be replicated in forms of soft-lithography and nanoimprinting, the enabling technologies in many of the today’s optical and diagnostic medical devices. These lithography platforms each offer unique advantages and use cases that bridge the gap between the fabrication processes of MEMS devices. In this Special Issue, we celebrate the diverse lithography technologies that are used in MEMS and bio-MEMS fabrication. The editorial board seeks on research papers, technology reports, communications, and review articles with a focus on the development, metrology, optimization, and the implementation of many forms of lithography processes in MEMS and bio-MEMS fabrication.  

We look forward to receiving your submissions!

Dr. Elliot Cheng
Dr. Anders Barlow
Dr. Zahra Faraji Rad
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • photolithography
  • maskless direct writing
  • electron beam lithography
  • focused ion beam lithography
  • two photon polymerization
  • nanoimprint
  • soft lithography
  • 3D nanofabrication
  • micro and nanofabrication
  • microfluidics

Published Papers (2 papers)

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Research

12 pages, 5407 KiB  
Article
Pile-Ups Formation in AFM-Based Nanolithography: Morpho-Mechanical Characterization and Removal Strategies
by Paolo Pellegrino, Isabella Farella, Mariafrancesca Cascione, Valeria De Matteis, Alessandro Paolo Bramanti, Lorenzo Vincenti, Antonio Della Torre, Fabio Quaranta and Rosaria Rinaldi
Micromachines 2022, 13(11), 1982; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13111982 - 15 Nov 2022
Cited by 3 | Viewed by 1169
Abstract
In recent decades, great efforts have been made to develop innovative, effective, and accurate nanofabrication techniques stimulated by the growing demand for nanostructures. Nowadays, mechanical tip-based emerged as the most promising nanolithography technique, allowing the pattern of nanostructures with a sub-nanometer resolution, high [...] Read more.
In recent decades, great efforts have been made to develop innovative, effective, and accurate nanofabrication techniques stimulated by the growing demand for nanostructures. Nowadays, mechanical tip-based emerged as the most promising nanolithography technique, allowing the pattern of nanostructures with a sub-nanometer resolution, high reproducibility, and accuracy. Unfortunately, these nanostructures result in contoured pile-ups that could limit their use and future integration into high-tech devices. The removal of pile-ups is still an open challenge. In this perspective, two different AFM-based approaches, i.e., Force Modulation Mode imaging and force-distance curve analysis, were used to characterize the structure of pile-ups at the edges of nanogrooves patterned on PMMA substrate by means of Pulse-Atomic Force Lithography. Our experimental results showed that the material in pile-ups was less stiff than the pristine polymer. Based on this evidence, we have developed an effective strategy to easily remove pile-ups, preserving the shape and the morphology of nanostructures. Full article
(This article belongs to the Special Issue The Lithography Technologies)
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7 pages, 3587 KiB  
Article
A Study on the Resolution and Depth of Focus of ArF Immersion Photolithography
by Jungchul Song, Chae-Hwan Kim and Ga-Won Lee
Micromachines 2022, 13(11), 1971; https://0-doi-org.brum.beds.ac.uk/10.3390/mi13111971 - 14 Nov 2022
Cited by 1 | Viewed by 3141
Abstract
In this study, the resolution and depth of focus (DOF) of the ArF immersion scanner are measured experimentally according to numerical aperture (NA). Based on the experiment, the theoretical trade-off relationship between the resolution and depth of focus can be confirmed [...] Read more.
In this study, the resolution and depth of focus (DOF) of the ArF immersion scanner are measured experimentally according to numerical aperture (NA). Based on the experiment, the theoretical trade-off relationship between the resolution and depth of focus can be confirmed and k1 and k2 are extracted to be about 0.288 and 0.745, respectively. Another observation for a problem in small critical dimension realization is the increase in line width roughness (LWR) according to mask open area ratio. To mitigate the trade-off problem and critical dimension variation, the photoresist thickness effect on depth of focus is analyzed. Generally, the photoresist thickness is chosen considering depth of focus, which is decided by NA. In practice, the depth of focus is found to be influenced by the photoresist thickness, which can be caused by the intensity change of the reflected ArF light. This means that photoresist thickness can be optimized under a fixed NA in ArF immersion photolithography technology according to the critical dimension and pattern density of the target layer. Full article
(This article belongs to the Special Issue The Lithography Technologies)
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