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Manufacturing and Maintenance

A special issue of Sustainability (ISSN 2071-1050).

Deadline for manuscript submissions: closed (31 July 2020) | Viewed by 522

Special Issue Editors


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Guest Editor
Centre for Digital Engineering and Manufacturing, Cranfield University, Milton Keynes, UK
Interests: augmented reality applications in manufacturing and maintenance; modelling maintenance requirements; digital twin; digitalisation of manufacturing processes
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Grenoble Institute of Technology, 38031 Grenoble, France
Interests: collaborative manufacturing systems
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Grenoble Institute of Technology (Grenoble INP), Grenoble, France
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Management and Engineering, Linköping University, Linköping, Sweden
Interests: ecodesign; design for sustainability; Product-Service System (PSS); circular economy; intelligent systems; customization
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue is focusing on the sustainability improvements that can be achieved by applying emerging digital technologies in through-life engineering services (TES). Sustainability is considered in terms of resource efficiency and effectiveness that can be derived in terms of usage of people, materials, parts, and energy.

TES are a set of capabilities, techniques, business thinking and network behaviours that, when applied to major assets, optimizes their value and cost (e.g., keeping major assets working better, for longer and more economically) (PAS 280). Major assets are generally understood to comprise complex engineered products, systems or system of-systems with an overall life measured in decades (e.g., 10 - 100+ years) and a need for significant in-use support investment.

Examples for emerging digital technologies include simulation, big data analytics, internet of things, virtual and augmented reality, autonomous robots, cyber security, and additive manufacturing. Many of these technologies still have significant challenges that need to be overcome in order to meet the potential performance and sustainability improvements. This Special Issue is focusing on solving such challenges by demonstrating new techniques, methods, and technologies that can produce enhanced sustainability within a TES context.

Dr. John Ahmet Erkoyuncu
Prof. Daniel Brissaud
Dr. Andreas Riel
Prof. Dr. Tomohiko Sakao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sustainability is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

There is no accepted submissions to this special issue at this moment.
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